Used FSM / FRONTIER SEMICONDUCTOR 128 #9191053 for sale

FSM / FRONTIER SEMICONDUCTOR 128 is a wafer testing and metrology equipment designed for semiconductor wafer manufacturing. FSM 128 is a die-to-die testing and metrology system used to measure critical device characteristics of integrated circuits on a semiconductor substrate or wafer. It uses a fully automated wafer alignment unit that positions the wafers accurately and quickly. The machine includes a four-point probe, an optical microscope camera, and a CCD backside camera that can measure a variety of critical wafer parameters such as die size, height, center of gravity, and pitch. The four-point probe measures die thickness and die resistance. The microscope is used to perform optical inspection of the die to identify structural defects such as bridges, opens, and shorts. The backside camera is used to capture and analyze backside images for foreign material contamination, and other surface or near surface defects. The wafer testing and metrology tool includes an X-Y stage with a precision-controlled, non-contact alignment asset. This model guides the wafers accurately over the probe and microscope to capture the desired information. The equipment also includes a powerful control software package that allows for easy programming of the test parameters and provides tamper-proof user authentication and enhanced security. FRONTIER SEMICONDUCTOR 128 features low-temperature data acquisition, allowing it to measure temperature-dependent parameters such as dieresistance at temperatures below ambient. The system is designed for high speed wafer testing, providing test times up to three times faster than alternative systems. In addition, the unit includes numerous communication interfaces and sophisticated traceability to allow for reliable data storage and retrieval, and precise repeatability of test results. The machine is also designed with a calibration tool so that tests can be planned and executed accurately. 128 is unmatched in its accuracy and capability to test complex semiconductor wafers in a cost-effective manner. This advanced wafer testing and metrology asset provides a wide range of critical device characteristics that are vital to the semiconductor manufacturing process.