Used FSM / FRONTIER SEMICONDUCTOR 413 EC MOT (DP) 300 #9392940 for sale

ID: 9392940
Vintage: 2010
Wafer thickness measurement system With automatic X-Y Stage Thickness measurements of bonded wafers: Si-Glass Si-Si Si-Tape Si-Epoxy GaAs InP Sapphire Quartz Trench depth measurements: High aspect ratio trench in MEMS Surface roughness measurements: Back grind Etched Polished wafers 2010 vintage.
FSM 413 EC MOT (DP) 300 is a wafer testing and metrology equipment designed to measure the electrical and geometrical characteristics of a wide variety of materials at the semiconductor device level. With its industry-leading combination of speed, accuracy, and flexibility, this system is used to develop and optimize semiconductor devices and to provide feedback for process improvement. FRONTIER SEMICONDUCTOR/FRONTIER 413 EC MOT (DP) 300 offers the ability to measure on a variety of wafer production materials such as silicon, silicon-on-insulators (SOI), GaAs, and III-V compounds, as well as bulk, patterned, and hybrid wafer devices. The unit includes a digital signal analysis capability and a surface acoustic wave (SAW) tester, which enables it to detect defects and imperfections in these materials. The machine is equipped with an efficient vector channel which allows for simultaneous and independent measurement of multiple electrical parameters. This offers an increased precision when compared to more conventional systems. Additionally, the integrated motion controller and advanced imaging capabilities of FSM / FRONTIER SEMICONDUCTOR/FRONTIER 413 EC MOT (DP) 300 provide repeatable and accurate point-to-point measurements, even in the most challenging environments. The integrated SAW tester offers superior defect detection accuracy. SAW testing can detect both defects on the surface of the wafer and any embedded defects in the material below the surface of the wafer. The integrated motion stages allow for precise sample handling in multiple dimensions, creating reliable repeatability in testing. With its combination of motion and imaging capabilities, the tool can accurately measure several parameters simultaneously. FSM/FRONTIER 413 EC MOT (DP) 300 utilizes a powerful suite of advanced metrology tools. It comes equipped with an integrated near-field scanning optical microscope (NSOM), which allows for high-resolution imaging of the wafer's surface. This microscope utilizes long-working distances and a wide field-of-view to study the features of individual device patterns. Additionally, the asset comes equipped with atomic force microscopy (AFM), which can detect nanoscale surface defects on the wafer. FRONTIER SEMICONDUCTOR/FRONTIER 413 EC MOT (DP) 300 is a powerful wafer testing and metrology model that offers the flexibility and accuracy required to measure the electrical and geometrical characteristics of a wide variety of materials used in semiconductor device production. With its combination of advanced motion controllers, imaging capabilities, and metrology tools, the equipment provides precise, repeatable measurements and reliable defect detection.
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