Used FSM / FRONTIER SEMICONDUCTOR 900 #9293062 for sale
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ID: 9293062
Wafer Size: 8"-12"
System, 8"-12"
Integrated metrology chamber
Temperature up to 900°C
Vacuum / Inert gas purge
2D/3D Stress mapping option.
FSM / FRONTIER SEMICONDUCTOR 900 is a wafer testing and metrology equipment that is designed to provide high-speed and accurate measurements of semiconductor wafers. The system can be used for a variety of wafer metrology processes, such as defect inspection, fault detection, defect localisation, capacitance-to-voltage (C-V) measurements, and electrical parametric testing. FSM 900 is equipped with an automated wafer-handling unit that is capable of loading wafers in a variety of configurations. This machine is able to precisely detect and locate defects on the wafer surface by utilising optical and electrical probes. It also has the capability for in-line process monitoring and automatic defect analysis. The tool is equipped with a Vacuum Load Port (VLP) that enables wafer-handling such as Pick-and-Place without the use of a manual procedure. FRONTIER SEMICONDUCTOR 900 is also equipped with an advanced die-bonding asset which eliminates the need for manual bonding of dies on the wafer. The model has is also equipped with an advanced C-V measuring equipment which allows accurate measurement of electrical parameters for semiconductor devices. This system has the ability to measure and analyse C-V curves with up to 10,000 points per second. 900 also features a comprehensive defect-localisation unit which enables the precise location of both on-chip and off-chip defects. The machine is further equipped with an advanced optical imaging tool which is capable of performing high-resolution imaging of wafers. The asset is also capable of performing diagnostics on wafers with powerful software algorithms such as adaptive thresholding and geometrical morphology. In conclusion, FSM / FRONTIER SEMICONDUCTOR 900 can be used for a variety of wafer metrology processes. It is equipped with an automated wafer-handling model, die-bonding equipment, C-V measuring system, and a defect-localisation unit. It also features an advanced optical imaging machine for high-resolution imaging. This tool is capable of performing accurate and high-speed measurements of semiconductor wafers.
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