Used HEIDENHAIN ND 281B #293643227 for sale

HEIDENHAIN ND 281B is a full-featured wafer testing and metrology equipment that uses a laser interference-based technology to nondestructively measure the local surface properties of semiconductor wafers. The system provides long-term repeatability and accuracy for the generation of data about surface contours, surface defects and surface topography. ND 281B includes a high-precision translational stage of 500 mm x 600 mm with a 5 nm step resolution, allowing for high levels of accuracy and repeatability. It also includes an in-plane movement unit with a sub-micron range resolution. Additionally, the machine uses a laser interferometer with operating bandwidths up to 100 kHz for sub-micron resolution and fast measurements. The tool is compatible with a variety of objectives, such as oil and air configurations, compatible with any object field range. For test runs, the asset offers high-intensity illumination up to 0.1 mW/cm2. For scanning and metrology, the model offers three different scanning regimes: 2D-scanning, 3D-scanning and offset scanning which can be used to measure within a specific pattern. The scanning patterns are generated with a high-level, graphical programming language and are easily adaptable to different physical layouts. Additionally, the equipment can be used for testing multilayer semiconductor samples and is also capable of standard pulse measurements on high density devices. The system's software provides a comprehensive suite of image analysis, data summarization and measurement tools to analyze and interpret the data from the measurements. The software also provides graphical post-processing capabilities, such as curve fitting, for additional data analysis. Furthermore, the software offers a high-level data communication interface both for input and output making it easy to integrate with existing systems and databases. Overall, HEIDENHAIN ND 281B wafer testing and metrology unit is a powerful tool for measuring local surface properties of semiconductor wafers. Its superior scanning capabilities and graphical programming language enable rapid and accurate measurements of high-density devices while its simplistic software provides comprehensive image analysis and data summarization functions, making it suitable for a range of applications.