Used HELIOTIS Helicam 3.0 #293641501 for sale

HELIOTIS Helicam 3.0 is an advanced wafer testing and metrology equipment designed for precision performance in semiconductor production, research, and development. It is made up of a number of innovative hardware and software components that work together to deliver an unprecedented level of accuracy, stability and repeatability in measuring, inspecting, and analyzing surface patterns of a wide range of semiconductor materials. The Helicam 3.0 is built around HELIOTIS award-winning optic imaging system. This unit is based on a self-contained suite of components that can be arranged to provide a large field-of-view and resolution as needed, with a wide range of output formats and options available. This machine includes an environment-controlled stage, an S-VGA-style camera, real-time video, and proprietary image analysis and software packages. The tool is equipped with a custom-designed high-precision air-bearing metrology stage that offers up to three micron accuracy with repeatability of 0.5 microns when the imaged pattern is static in nature. The stage is made up of a ceramic-core sweep rotor, a graphite bearing surface, and precision linear guide blocks for ensuring absolute velocity stability. The sensor is integrated with a high-precision motion control asset that allows for precise motions as small as 0.1 micron/sec. The Helicam 3.0 also features an automated vision model that can detect, focus, and measure features with high accuracy. The equipment is designed to reduce the risk of errors due to camera drift or out-of-view sensing, and requires no separate alignment. The Helicam 3.0 is also equipped with an integrated calibration and positioning system, which is used to deliver precise images and enable the angular alignment necessary for automated pattern matching and inspection. The unit allows for precise targeting of target locations and is integrated with both the motion and image-analysis controls for automated scanning operations. The machine is also fitted with HELIOTIS proprietary MagicPrintSmart™ software, which provides the tools necessary to perform sophisticated wafer measurements and analysis including overlay, CD/FID analysis, defect inspection and review. Overall, the Helicam 3.0 is a highly-advanced and precise wafer testing and metrology tool that provides accurate results in a fast, efficient, and cost-effective way. It offers a unique combination of technologies and features that make it the perfect choice for a wide range of semiconductor production needs.