Used HIKE VR300DLF #9397726 for sale

HIKE VR300DLF is a wafer testing and metrology equipment designed to provide an accurate and comprehensive view of micro wafer characteristics across a wide range of process nodes. This system has a dynamic digital imaging and dimensional testing feature that allows for highly precise measurement and characterization of each die. The unit collects and displays a variety of image data in real-time and provides digital images of the wafer's surface along with relevant performance data. VR300DLF allows for automated wafer analysis and probing, using high-resolution cameras and two large fiducial and die recognition sensors. This advanced technology can identify defects across all process nodes, no matter how small. Fidicial recognition and die data is used to create a map of the wafer and track measurements with high accuracy. The machine also features an advanced, high-speed alignment tool with a submicron resolution. The alignment asset uses a dual-camera comparison technique and multi-tool autofocus for enhanced accuracy. This allows for more precise alignment with existing dies and improved accuracy within the context of high defect density applications. HIKE VR300DLF has a broad range of test methods and performance protocols. These include wafer inspection, scanning electron microscopy (SEM) imaging, transmission electron microscopy (TEM) imaging, elemental characterization, chemical-mechanical planarization (CMP) testing, electron beam test, local electrical test, and x-ray diffraction (XRD) mapping. Overall, VR300DLF model is a next-generation wafer testing and metrology equipment that combines automated probing and enhancement of existing process node technology with advanced image recognition, die alignment, and performance protocols, offering superior accuracy and quality of results. This system is ideal for process node applications where high defect detection, fault detection, and overlay alignment accuracy are critical.