Used HITACHI G-S006-02-0012 #9377468 for sale
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HITACHI G-S006-02-0012 is a wafer testing and metrology equipment which offers high accuracy and superior repeatability to ensure maximum yield in semiconductor fabrication. The system provides excellent performance, reliability and cost-effectiveness to meet the increasing demands of the semiconductor manufacturing industry. G-S006-02-0012 is a fully automated unit which can quickly and accurately test semiconductor wafers for shape, size, and other physical properties. It is equipped with a contact-type probe station, digital optical microscopy, high-resolution analytical detectors, and an advanced embedded controller to provide rapid and precise testing. The machine is built on a compact frame which takes up minimal space and reduces costs. In addition, HITACHI G-S006-02-0012 has a wide range of applicable materials, including single-hemispherical, SCUBA-type, and SOIC-type wafers. The contact-type probe station on G-S006-02-0012 is used to measure the physical dimensions of semiconductor devices. It features a series of probes which are manually placed in direct contact with the wafer surface. The probes are equipped with both capacitive and inductive sensors to detect the exact shape, size, and other physical characteristics of the wafer. The contact-type probe station also has a high-precision linear stage which allows for precise movement of the probes across the wafer. The digital optical microscopy provided by HITACHI G-S006-02-0012 allows for the microscopic inspection of wafer surface features. The tool is equipped with an advanced compound optical asset to capture high-resolution images of the wafer surface. The images can then be further analyzed using image processing techniques to detect minute defects such as cracks and micro-contours. The model also offers a wide range of operational modes, such as multi-layer inspection, pixel-level zoom, and fundus imaging. G-S006-02-0012 also utilizes a variety of analytical detectors to accurately quantify the electrical properties of the wafer. These include the High-Range Scanning Wide Area Detector (HRSA) and the Sweep Imaging Detector (SWID). The HRSA is used to measure the resistance and capacitance of the wafer surface, while the SWID can identify and locate small fluctuations in the voltage. Both detectors play an important role in ensuring the quality of the semiconductor devices produced. HITACHI G-S006-02-0012 provides a complete solution for wafer testing and metrology. Its integrated design, advanced features, and sophisticated detectors offer optimum performance at a cost-effective price. The equipment enables manufacturers to quickly and accurately test/inspect wafers for shape, size, and other physical properties while ensuring maximum yield in semiconductor fabrication.
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