Used ISIS SENTRONICS SemDex 301-34 #9129394 for sale
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ID: 9129394
Vintage: 2013
Wafer metrology system
Maximum accessible diameter: 210 mm (StraDex a3-50)
Accessible rotation: 90° / 180°
Auto focus
StraDex a3 - 50 (Precision mechanical bearing)
StraDex f24 - 300 (Airbearing)
Antivibration plate below chuck
Optical wavelengths:
StraDex a3 - 50: ~500 nm (Maximum height evaluation 120 μm)
StraDex f24 - 300: 1300 nm (Minimum silicon thickness 10 μm)
(2) Calibrated silicon objects:
123 μm thick plate with 10 nm roughness
300 μm thick plate with 1 nm roughness
Technical specifications:
Sensor system:
StraDex a3 - 50 (top left):
Field-of-view: (0.35 mm)^2
Lateral pixel size: 0.35 μm
Working distance: 3.5 mm
Auto-focus range: 4 mm
Maxmimum warp: <3 mm
Maximum Z-height: 60 μm (High-resolution ) / 120 μm
Repeatability (high-resolution): 0.5 nm (In-plane), 3 nm (step)
Total acquisition time: Type 4 seconds, 1 seconds (Reduced FOV)
Maximum focusing speed: 200 pm/s
StraDex f24 - 300 (Top & Bottom center):
Spot size: 24 μm
Auto-focus range: 24 - 44 mm
Maximum warp: 1.5 mm
Maximum acquisition rate (Fast mode): 4 kHz
Thickness (Silicon):
10-350 μm (Fast mode)
10 - 800 μm (Slow mode)
Thickness (Glass, Polymer):
20 - 750 μm (Fast mode)
20 - 1000 μm (Slow mode)
Acquisition rate: <4 kHz
Accuracy and repeatability conditions:
Surface roughness Rz < 0.1 μm
Confidence range: 2 Sigma
Thickness sensor (Stradex f24 - 300) performance:
Absolute accuracy: < +/- 0.5 μm
Repeatability (fast mode): < +/- 0.1 μm
Repeatability (slow mode): < +/- 0.5 μm
Stage:
Maximum X / Y Travel range: 300 x 300 mm^2
Maximum velocity: 30 mm/s
Lateral accuracy: 2 μm
Maximum height variation repeatable: 2 μm
Free positioning via keypads
Anti-vibration table
Air suspension
Perforated vacuum:
Chuck for double side (Swiss cheese)
Unframed and framed wafers for 6"-12"
Inter-center spacing: 10 mm Holes at 20 mm
Vacuum for wafer suction (6 Bar air pressure required)
Computer: Intel i7 with screen
(2) HDD Raids
With (2) 1TB
Fan filter unit: ISO Class 10
Housing: White powdered coating
Data interface: LAN
Temperature: 10°C-35°C
Power supply: 100-240 V, 50-60 Hz, 3kW
Barcode scanner
Barcode and recipe
SECS/GEM Extension:
SEMI (E 30, E 37, E 5) Includes
Recipe handling (RMS)
2013 vintage.
ISIS SENTRONICS SemDex 301-34 is a wafer testing and metrology system designed for semiconductor production, inspection, and packaging applications. It is powered by an advanced optical sensing and inspection system developed specifically for the semiconductor industry. It offers an integrated solution for defect detection, topography analysis, electrical characterisation, overlay and position registration, and 2D/3D wafer inspection. SemDex 301-34 features a variety of engraving and scanning technologies to perform both process and metrology operations. The unit is equipped with a full suite of on-board imaging tools including a range of laser, line scan, and AutoTrack cameras. An in-process electrical test system is integrated, allowing real-time reporting on the electrical parameters of tested devices. ISIS SENTRONICS SemDex 301-34 provides detailed die mapping capabilities, allowing users to accurately verify the locations of all defects. Various high-speed scan modes are available to accurately characterize the entire wafer, and the high resolution imaging tools make it possible to detect even the smallest defects. The unit provides superior results regardless of wafer condition, and is capable of inspecting wafers of any size, shape, and thickness. SemDex 301-34 also features powerful Overlay and Offset management capabilities. A real-time offset analyzer provides coverage measurements down to 5 nanometers in order to guarantee precise alignment of the wafer during scanning. Batch inspection and pattern recognition features are provided for rapid, automated defect assessment and data analysis. ISIS SENTRONICS SemDex 301-34 is a powerful and reliable tool for semiconductor testing, inspection, and packaging needs. Its robust design and advanced capabilities make it suitable for a wide range of applications, from simple die inspections to complex process and metrology operations. SemDex 301-34 can be used to achieve higher yield rates, reduce costs, and guarantee maximum quality assurance in the semiconductor field.
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