Used ISIS SENTRONICS SemDex A32-34 #9407579 for sale

It looks like this item has already been sold. Check similar products below or contact us and our experienced team will find it for you.

ID: 9407579
Wafer Size: 8"-12"
Vintage: 2011
Wafer testing and metrology system, 8"-12" Automatic loading (2) Load ports (12" FOUB and 8" Open cassette via 12" Mechanical adaptor) Measurement part: Automated measurement: Substrate / Layer / Total thickness Bow / Warp Mini-bumps / Vias (Micro 3D metrology) and nm roughness Integrated sensor heads: Layer thickness / Bow: StraDex f2 - 80 (Top), StraDex f24 - 300 (Bottom) 3D micro-topography: StraDex a3 (Top, off-center by about 90 mm) Camera function (Top sensor) Autofocus: StraDex a3 (Precision mechanical bearing) StraDex f2 - 80 StraDex f24 - 300 (Air bearing) Anti-vibration plate below chuck Optical wavelengths: Top sensor: 830 nm (Minimum Silicon thickness 2.5 μm) Bottom sensor: 1300 nm (Minimum Silicon thickness 7 μm) Top sensor (Off-center): ~ 500 nm Integrated calibration samples: Thickness sample silicon: 123 μm (Roughness in the several nm level) Thickness sample silicon: 750 μm (Roughness in the several nm level) Step profiles for 3D Micro topography Cross hair for top and bottom thickness sensor alignment Sensor system with (3) StraDex sensor heads (Triple sensor setup): StraDex f2 - 80 (Top): Spot size: 8 μm Autofocus range: 2 - 22 mm Maximum warp: 3 mm Acquisition rate: < 4 kHz Thickness (Undoped silicon): Fast mode: 2.5 - 80 μm Slow mode: 2.5 - 80 μm Thickness (Glass, polymer): Fast mode: 5 - 200 μm Slow mode: 5 - 200 μm StraDex f24 - 300 (Bottom): Spot size: 24 μm Autofocus range: 24 - 44 mm Maximum warp: 2 mm Acquisition rate: < 4 kHz Thickness (Silicon): Fast mode: 8 - 350 μm Slow mode: 8 - 800 μm Thickness (Glass, polymer): Fast mode: 14 - 300 μm Slow mode: 14 - 1000 μm StraDex a3 (Top): Field-of-view: (0.35 mm)² Lateral pixel size: 0.3 μm Working distance: 3.5 mm Autofocus range: 4 mm Maximum Z-height: 60 μm (High-res.) / 120 μm (Low-res.) Repeatability: 0.5 nm (High-res.) Total acquisition time: 2 - 3 sec. Maximum focusing speed: 200 μm/s Surface roughness: Rz < 0.1 μm Confidence range: 2 Sigma Single sensor mode: Absolute accuracy: < ± 0.5 μm Repeatability (Fast mode): < ± 0.1 μm Repeatability (Slow mode): < ± 0.5 μm Twin sensor (Layer thickness) mode: Absolute accuracy: < ± 1 μm Repeatability (Fast and slow mode): < ± 0.5 μm Stage: Maximum X/Y travel range: 300 x 300 mm² Maximum velocity: 30 mm/s Lateral accuracy: 4 μm Maximum height variation repeatable: 2 μm Free positioning via keypads Anti-vibration table Air suspension Perforated vacuum chuck for double side measurements of 6", 8" and 12" unframed and framed wafers 10 mm Holes at 20 mm inter-center spacing Vacuum for wafer suction 3 Lift pins to elevate the wafer (≥ 200 mm in diameter) by 9.5 mm Wafer handling: Up to 60 wafers / hour Single ATM robot with vacuum gripper Pre-aligner OCR reader (Standard: Top scribe readout) General: Industrial computer (2 GHz) with screen Data interface: LAN Fan filter unit, ISO class 10 Temperature: 10°C - 35°C Power supply voltage: 100 V - 240 V, 50-60 Hz Maximum power consumption: 5 kW Sensor missing 2011 vintage.
ISIS SENTRONICS SemDex A32-34 is a wafer testing and metrology equipment designed for component analysis, surface metrology, and electrical evaluation. It is capable of testing and measuring various wafer substrates including thin and thick-film, monolithic and embedded-circuit, and polysilicon. SemDex A32-34 incorporates a fully automated testing and metrology system, allowing for precise and repeatable results. It uses an X-Y-Z scanning stage for precise wafer positioning and movement, providing accurate alignment and repeatability between wafer locations. This stage is controllable by a PC based controller (PCBC) and is capable of scanning up to 100 individual areas of the wafer. ISIS SENTRONICS SemDex A32-34 includes a high performance elecro-optical detection package, including a high-resolution CMOS camera and bright-field microscope, giving it the capability to detect and analyze large areas of a single wafer. This package also includes a voltage mode characterization unit, allowing for precise measurement of wafer parameters. The machine is also equipped with an advanced algorithm-based software package, providing users with the capability to analyze their scan data in a variety of ways including surface metrology calculations, fault detection, and statistical process control. In addition, the tool provides real-time visualization of the scan data, allowing the user to quickly review the results. Other key features of SemDex A32-34 include its ability to provide a wide array of test and measurement capabilities, such as 4-point probe measurement and electrical current mapping, as well as cutting-edge imaging algorithms for the detection of ultra-small defects and contaminants. In conclusion, ISIS SENTRONICS SemDex A32-34 is a comprehensive wafer testing and metrology asset designed for precise and repeatable results. It incorporates a number of advanced features for testing various wafer substrates, such as a fully automated X-Y-Z scanning stage, high resolution imaging model and an algorithm-based software package, allowing users to analyze their scan data quickly and accurately.
There are no reviews yet