Used KLA / TENCOR 4000 SURFSCAN #293590366 for sale

KLA / TENCOR 4000 SURFSCAN is a wafer testing and metrology equipment specifically designed to provide high-precision measurements of wafer topography. The system is comprised of an optical microscope, a precision c-axis stage, interferometric profilers, scanning tunneling microscope (STM), optical scatterometer, and a statistical analysis unit. The machine is designed to provide a complete analysis of a wafer's entire topography, including size, shape, and surface variability. KLA 4000 SURFSCAN's optical microscope is equipped with a high-quality digital camera and provides a high-resolution image of a wafer's topography. This data can then be analyzed using the precision c-axis stage. The c-axis stage is capable of moving the wafer in both the x and y axes, allowing for extremely precise measurements down to the nanometer scale. The precision c-axis stage is also capable of automation, providing repeatable accuracy for each measurement. The interferometric profilers of TENCOR 4000 SURFSCAN are able to measure the finer details of a wafer's surface. These profilers are able to reveal height variations down to the atomic level and generate high-resolution 3D images of a wafer's topography. The high-resolution images provide invaluable insights into the uniformity and features of the surface. Additionally, 4000 SURFSCAN tool is equipped with an optical scatterometer that is capable of detecting surface roughness, texture, and scattering patterns. The optical scatterometer is able to distinguish between different feature types on a wafer and quantify their dimensions. Finally, KLA / TENCOR 4000 SURFSCAN is equipped with a sophisticated statistical analysis asset. This model provides automated correlation of interferometric and scatterometric analyses to generate powerful visualizations of a wafer's topography. This equipment can then be used to optimize yield, improve uniformity, and reduce manufacturing costs. KLA 4000 SURFSCAN is a powerful system for wafer testing and metrology. Its combination of a high-quality optical microscope, highly precise c-axis stage, interferometric profilers, scanning tunneling microscope, and optical scatterometer provide the information needed to gain a detailed understanding of the wafer's topography. This unit is able to provide detailed height maps and 3D images of surface features, detect surface roughness and texture, and generate powerful visualizations to optimize yield and reduce manufacturing costs.