Used KLA / TENCOR 4000 SURFSCAN #9229798 for sale

KLA / TENCOR 4000 SURFSCAN is a powerful wafer testing and metrology equipment that offers high accuracy and stability in a compact package. The system consists of an echelle imaging unit, a motorized sample stage, four radiation channels, a high accuracy optical laser interferometer and integrated signal processing and control. The echelle imaging machine allows for rapid and precise scanning of a wide variety of sample types including bare, bump bonded wafers, dual wafer stacks and multi-layer devices. This tool uses a collimator/programmable shutter aperture mask combined with an array of high resolution CCD cameras to acquire detailed images of the feature structures for evaluation and comparison. The motorized sample stage is capable of precise and repeatable X/Y/Z motion, offering an excellent platform for precise wafer-level measurements. The X/Y motion is driven by stepper motors and overlaps to enable a rapid and repeatable scanning process. The Z motion is driven by a DC motor and allows for a z-focus to ensure the highest level of accuracy for gap and other three-dimensional measurements. The integrated laser interferometer is built-in to allow for adjustment of sample heights in the X/Y plane. The asset operates by combining radiation from four separate radiation channels: a visible wavelength spectrum (VIS), a near-infrared spectrum (NIR), an ultraviolet spectrum (UV) and an ultraviolet/THz spectrum (UV-THz). This combination of radiation sources allows for precise determination of the wafer topography, as well as evaluation of defects and die-by-die performance. The radiation is combined through a sample imaging model and directed onto the sample, where it is then reflected back to the sensors. KLA 4000 SURFSCAN wafer testing and metrology equipment provides accurate, non-destructive analysis of both bare and bumped wafer specimens. Through its combination of radiation sources and optical interferometry, the system is capable of acquiring comprehensive, high-resolution images of both dies and structures. The unit is also designed for easy integration with automated handling systems, enabling efficient use of resources when processing large percentages of wafers. As such, it is an excellent tool for failure analysis and process control in the semi-conductor fabrication industry.