Used KLA / TENCOR 4500 SURFSCAN #293824952 for sale

KLA / TENCOR 4500 SURFSCAN is an advanced wafer testing and metrology equipment. It is ideal for high-precision, high-throughput measurement of film thickness,s wafer topography and other critical geometrical parameters. The system contains a Scanning Electron Microscope (SEM) and an integrated Ellipsometer, allowing for simultaneous measurement of all critical wafer surface parameters. The integrated software package enables advanced metrology capabilities, allowing users to quickly and accurately analyze data and identify film discontinuities and particle contamination. KLA 4500 SURFSCAN has a fast scan speed and a wide measurement range, making it suitable for a variety of wafer testing applications. The unit utilizes an advanced 12-bit charge coupled device (CCD) camera for high-resolution imaging and analysis, and a wide range of accessories available for specific applications. The machine can measure a variety of wafer parameters, including wafer topology, oxide thickness, etch depth and other critical geometries. The integrated software packages enable users to easily evaluate the symmetrical and uniformity of the layer surfaces, and provide graphical display of information. The tool also features an in-built Particle Analyzer package allowing users to quickly analyze incoming wafers for particle contamination. The integrated particle tracking software is capable of detecting particles with sizes as small as 1 micron. The particle analysis package includes image storage and advanced pattern recognition algorithms to reduce particle false positives. TENCOR 4500 SURFSCAN is an excellent metrology and imaging tool for the characterization of critical wafer parameters. It is specifically designed for advanced metrology applications, such as ultra-high-resolution 3D imaging of both transient and invariant structures. 4500 SURFSCAN can measure parameters such as surface topography and wafer thickness, enabling users to make quick and accurate evaluations of wafer status. The integrated particle analysis package helps to ensure the highest levels of accuracy and yield in wafer testing.