Used KLA / TENCOR 4500 SURFSCAN #9355439 for sale

KLA / TENCOR 4500 SURFSCAN is a state-of-the-art wafer testing and metrology equipment that is used to accurately measure the topography of wafers. The system performs three-dimensional optical critical dimension (CD) measurements, and provides the ability to monitor the process variations of semiconductor devices. KLA 4500 SURFSCAN utilizes patented Fourier Transform Profilometry (FTP) technology which uses an interferometer, based on a relatively low-cost commercial dielectric mirror, to measure the topographical features of a wafer surface. This unit then allows for precise CD measurements of the features and their differences between the start and end of a process run. TENCOR 4500 SURFSCAN comes equipped with a variety of devices and tools such as a motorized XY stage for wafer handling and translation; a motorized Z stage for motion control of the interferometer "expansion" (in focus) objective lens; an integrated microscope/ir fluorescent pattern recognition mode for wafer alignment and registration; a power supply for the interferometer beam splitter; and a sample probe for minimal contact scanning and sampling functionality. 4500 SURFSCAN also provides users with a variety of analysis and visualization capabilities. Firstly, it is capable of providing detailed information including CD measurements in several formats. This is due to its real-time image processing capabilities, which can rapidly detect changes in process conditions. Additionally, it is capable of providing information on changes in spectral images, as well as shift in pattern intensities. Secondly, the machine allows users to filter data in order to focus on specific trends and fluctuations. Lastly, with its automated CD measurement capabilities, KLA / TENCOR 4500 SURFSCAN is able to deliver CD measurements more quickly and accurately than ever before, allowing users to quickly detect process issues. Overall, KLA 4500 SURFSCAN is a powerful and efficient tool for quickly and accurately measuring the topography of a wafer for semiconductor device process monitoring. Its versatile and advanced design allows users to accurately detect changes in process conditions, improve wafer yield, reduce process scrap and ultimately increase profitability.