Used KLA / TENCOR 5011 #136438 for sale

KLA / TENCOR 5011 is a high-sensitivity, non-contact automated wafer testing and metrology equipment. It is used for a variety of semiconductor applications, such as wafer surface inspection, wafer defect localization, critical dimension (CD) measurements, overlay error measurements, and surface profile measurements. KLA 5011 system makes use of two advanced non-contact imaging technologies, which enable high-speed and ultra-sensitive wafer data analysis. Optical scatterometry (OS) techniques, which are used for wafer surface characterization, enable rapid measurements with improved accuracy and repeatability, even on wafers with intricate surface structures. An scanning electron microscope (SEM) imaging unit, installed beneath the OS machine, enables the operator to identify, isolate, and analyze a single feature or defect on the wafer surface. These two advanced technologies are linked to the integrated KLA tool, which provides critical information such as a detailed scan of the wafer surface and overlay information. This enables the operator to analyze the wafer geometry, defects, and composition quickly and accurately. TENCOR 5011 asset is designed to be highly automated, with a 15-second cycle time, a full-bitmap image acquisition rate of 1.1 seconds, and a 200 wafers/hour throughput. It can also handle wafers with diameters from 2 inches to 8 inches, and the minimum feature size is 1 micron. The model's sophisticated algorithms enable fast, automated shape analysis, even for complex surface structures with sub-micron features. In addition, TENCOR proprietary auto-operator feature enables the user to rapidly and accurately identify and evaluate outliers on the wafer map. This feature automatically determines and displays trends and finds process parameter changes quickly. 5011 equipment is designed to provide robust performance, speed, and accuracy, and it can be used in a wide variety of applications. KLA / TENCOR offers a range of optional add-on modules, including the ability to measure the board edge, automated pore and void analysis, punch-hole alignment, pad surfaces, and scribe-lines. This system is designed to be upgradeable and capable of being integrated into existing production lines. Its robust performance ensures that the operator can obtain reliable wafer testing results every time.