Used KLA / TENCOR 5300 #9205448 for sale

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ID: 9205448
Wafer Size: 8"
Vintage: 2001
Overlay measurement system, 8" Control console: Console PC Monitor keyboard and mouse (Track ball) Video printer Sub storage device (CD / Floppy / Tape) Power & signal cables Handler: Robot Power & signal cables Inspection staion: Mainbody stage X&Y chuck stage Optic Power & signal cables Components name: Line conditioner Handler Console PC DSW Included: Lexmax printer Backup floppy Spanner Power supply: 208V, 50/60 Hz, 12.5A, 1P 2001 vintage.
KLA / TENCOR 5300 is an advanced wafer testing and measurement equipment tailored for semiconductor manufacture. As part of the fifth-generation sorter family, KLA 5300 employs intelligent algorithms, sophisticated optics, and industry-leading metrology to support the detection of defects in-situ, and to help optimize performance. Designed for maximum throughput, TENCOR 5300 supports a wide range of high-accuracy probe cards and hardware components to inspect, classify, and measure wafers and chips at the highest level of accuracy and speed. The system's advanced silicon microscopy provides 2D and 3D imaging, allowing inspection of both surface and internal defects. 5300's unique design ensures defect resolution down to 0.7 μm. Data capture and analysis are also an integral part of the unit's operation. By combining engineering knowledge and advanced onboard analytics, KLA / TENCOR 5300 can accurately detect, classify, and measure a variety of defects. Particular features include automated measurement, automatic alignment, advanced imaging processes, and a host of automated data input options. KLA 5300 is used in a variety of production applications, from imaging and measuring step heights to scanning both forward-looking and TEM images. It is also used for line width measurement, process evaluation, surface roughness inspections, 3D layering, chip flipping, electrostatic discharge detection, and device inspection. To maximize performance, TENCOR 5300 integrates with an array of advanced data analysis tools, including die-to-die comparison, SPC analysis, design rule checking, and chip-to-wafer mapping. Additionally, proprietary image enhancement algorithms enable better defect classification. All data captured on the machine can be exported to industry-standard file formats, increasing collaboration between departments. Overall, 5300 provides powerful, efficient support for semiconductor wafer testing and metrology. Featuring advanced optics and analytics, high-accuracy probe cards, and automation to support operation, the tool enables fast, precise defect testing and measurement.
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