Used KLA / TENCOR 6200 #293656105 for sale

KLA / TENCOR 6200 is a state-of-the-art wafer testing and metrology equipment that offers high-precision non-destructive 3D mapping capabilities. Its advanced dual stage optical sensor features calibration independent optical systems with a minimum pixel pitch of 0.3 µm, making it ideal for the quantitative identification of extremely small feature sizes, such as those found in semiconductor wafers. This system's integrated dual stage lighting unit and near-infrared (NIR) sensor enables multiple layers of data to be collected in a single measurement. For quality control and process optimization, KLA 6200 offers fast, accurate non-destructive, non-contact 3D measurement capabilities. This machine is capable of measuring each feature on the surface of a wafer with up to 16 levels of detail, providing quick and accurate results. TENCOR 6200 also offers automated surface cleaning and dry scanning, while automated image processing features further streamlined the inspection process and reduce the need for manual intervention. All data collected is stored for future use, enabling rapid recall of processed and non-processed data. In addition, 6200 features precise lateral resolution of 0.5µm and a maximum heights sensitivity of 70nm. This allows for the measurement of thicker substrates up to and including 3mm while maintaining an accuracy of 5nm or better. Its wide dynamic range extends from 0.005 to 1000 µm, making it highly suitable for analyzing complex surface shapes and contours. KLA / TENCOR 6200's user-friendly graphical user interface (GUI) make it easy to set up, learn and run even the most complex wafer inspection protocols. This tool's built-in analysis tools enable pattern recognition, defect tracking, and probing of data points, making it an ideal choice for wafer-level testing and metrology. In summary, KLA 6200 is a powerful and versatile wafer testing and metrology asset that offers fast, accurate non-destructive 3D measurement capabilities. Its automated surface cleaning and dry scanning, precise lateral resolution, and wide dynamic range make it highly suitable for analyzing complex surface shapes and contours. In addition, its user-friendly GUI simplifies the setup and operation of this model, making it an ideal choice for wafer-level testing and metrology.