Used KLA / TENCOR 6420 #293656103 for sale

KLA / TENCOR 6420 is an advanced wafer testing and metrology equipment that can analyze up to 8 wafers in parallel. It features an ultra-high-resolution combination of optical interferometry, confocal microscopy, and other imaging technologies. The system can measure multiple parameters of a single device or multiple structures on a single wafer with high accuracy in only a few minutes. The wafer testing and metrology unit includes a high-precision, three-dimensional, interferometer that measures both surface topography and optical thin film thickness. The machine also features a dual detector which offers extreme flexibility in analyzing a variety of different structures that may exist on the wafer. It can measure features such as resistivity, critical dimension thickness, etc. The tools onboard KLA 6420 also provide a powerful suite of data analysis capabilities that can help identify structural, electrical, and lithography defect features in multiple dimensions. It is capable of extracting layerheight and sidewall angle information, peak-valley analysis, and calculating curvature and roughness as well. It is also equipped with a pulse synchronous detection technology, allowing for the simultaneous acquisition of multiple topographic measurement parameters from a variety of structures. TENCOR 6420 also boasts a sophisticated graphical user interface which simplifies the data acquisition process. It can run multiple wafer tests simultaneously, while displaying data, graphs, and images of the measurements it has made. The tool also offers a variety of different software packages, such as software for the generation of CMP (Chemical Mechanical Polishing) maps, which can be used to analyze planarity across the entire surface of a wafer. Powerful and versatile, 6420 is a top of the line wafer testing and metrology asset that provides accurate and reliable data across multiple test parameters, allowing production engineers and R&D personnel to quickly identify device or structure defects with ease.