Used KLA / TENCOR 7700M Surfscan #293604335 for sale

KLA / TENCOR 7700M Surfscan is a state-of-the-art wafer testing and metrology equipment used in the manufacturing and semiconductor industry. The system provides non-destructive wafer test and measurement capabilities such as high resolution imaging, surface analysis, cross-sectional and 3D analysis, non-contact electrical characterization, and overlay measurements. The Surfscan 7700M offers high resolution imaging, allowing for the identification of extremely fine structures, films and defects, which facilitates the analysis and verification of device structures, fabrication processes, and device performance. With a 5µm resolution and an integrated 5 megapixel camera, the unit can acquire detailed images of the entire wafer at speeds of up to 12 fps. It also offers simultaneous acquisition of up to 10 features using its multi-focal plane detection (MFP) feature. The Surfscan 7700M provides wafer surface analysis, allowing for the identification and quantification of surface roughness, contamination, defects, and grain structure for a variety of substrates. Its particle analysis feature offers the ability to map contamination and particle distribution on any surface. It also features a 3D topography mode, which enables depth and feature profiling capabilities to identify defects and critical features. The machine offers non-contact electrical characterization of wafers, which allows for the characterization of electrical properties of integrated circuits or other devices. Its transfer length (TL) measurement tool measures the length of the transmission line across a device, while its output characteristics asset measures the output characteristics of a device. It also provides IC overlay measurements, which enable the determination of overlay alignment of IC devices in the production process. KLA 7700M Surfscan is an advanced wafer testing and metrology model that offers high resolution imaging, surface analysis, cross-sectional and 3D analysis, non-contact electrical characterization, and overlay measurements. With its capabilities it can be used to aid in the production and verification of a variety of wafer devices and applications.