Used KLA / TENCOR 8250 T #9191936 for sale

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ID: 9191936
Vintage: 2006
Lead scanner 2006 vintage.
KLA / TENCOR 8250 T is a wafer testing and metrology equipment designed for advanced characterization of semiconductor wafers. This system utilizes an automated surface inspection technology known as '8K' imaging to detect defects in the upper surface and sidewalls of wafers with great accuracy and sensitivity. It also offers the highest available resolution and signal-to-noise ratio, and is capable of detecting very minor defects with the same high level of accuracy. It can also detect a large variety of types of defects including protrusions, pits, and patterning irregularities, as well as analyzing complex and three-dimensional features. KLA 8250 T has a large 8K automated wafer inspection area capable of handling substrates up to 86mm. The unit is equipped with an advanced imaging spectrometer for automated analyses of wafer surfaces. This spectrometer utilizes a light source with a wavelength range from 400 to 40 nanometers (nm) and can access a wide range of imaging conditions including various subvisible, visible and ultraviolet radiation. In addition, this machine is equipped with an automated focus tool to maximize the signal-to-noise ratio and minimize errors. In addition to automated surface inspection, this wafer testing asset also features a full suite of metrology and characterization capabilities. Its high-precision metrology model can measure the thickness of films and layers, as well as monitor wafer warp and ensure absolute uniformity. The equipment can also measure and control the etch depth and wafer topography with superior precision. Furthermore, this system is capable of performing high resolution laser scanning to generate 3D maps of wafer surfaces with nanometer-scale resolutions. Overall, TENCOR 8250 T wafer testing and metrology unit is the ideal choice for advanced analysis of semiconductor wafers. Its 8K automated surface inspection technology ensures the highest accuracy and sensitivity for detecting defects in the wafers. In addition, it can perform a variety of metrology applications such as measuring the thickness of layers, monitoring wafer warp, and performing high resolution laser scanning. All of these features make 8250 T an optimal choice for advanced wafer testing and metrology needs.
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