Used KLA / TENCOR AIT UV+ #9228105 for sale

KLA / TENCOR AIT UV+ is a high-accuracy wafer testing and metrology equipment designed to enable the most accurate and comprehensive measurements of wafers used in the semiconductor manufacturing industry. The system allows wafer manufacturers to accurately measure the shape and size of components on the wafer, such as slopes, steps, and profiles. The unit combines multiple technologies to create a comprehensive measurement of wafer properties. The machine starts with a dual-beam laser scanning tool for precise mapping of the wafer's shape and features. The laser scans and captures an image of the wafers surface. This image then undergoes analysis in order to create a 3D map of the surface features. This is accompanied with an optically-detected global topography stage which is used to look at the overall flatness of the surface. The UV+ asset includes a patented ultraviolet reflectance technology that captures material-specific measurements of the topography, allowing direct relative material measurements. This technique enables the model to measure wafer thickness, contours, steps, and dendrites with extreme accuracy. The equipment also includes an expanded multichannel option for more comprehensive measurements of both materials and shape characteristics. This increased measurement capability is made even more powerful with the inclusion of software-based method control tools. These features allow wafer manufacturers to quickly set up and execute precise testing protocols specific to their production needs. KLA AIT UV+ system is a powerful and highly accurate wafer testing and metrology platform capable of providing precision measurements for wafers used in the semiconductor industry. Its combination of laser scanning and UV reflectance technologies ensures accurate measurements of shape and material characteristics, while its software-based method control tools enables efficient and repeatable testing. All together, the unit is a valuable tool for accurately measuring the shape and size of components on the wafer.