Used KLA / TENCOR AIT XP+ #78831 for sale

KLA / TENCOR AIT XP+ is an advanced wafer testing and metrology equipment. The system is designed to detect and identify defects and impurities in thin-film materials on semiconductor wafers. KLA AIT XP+ is capable of measuring parameters such as thickness, etch rate, and aspect ratio. It also has the capability to detect non-uniformity, allowing manufacturers to be sure that their wafers remain within specs. TENCOR AIT-XP+ is a stand-alone unit, meaning it can be used independently or integrated into existing production lines. The machine consists of three main components: a test chamber, a metrology unit, and a data analysis module. The chamber utilizes advanced optics, including a helium-neon laser and full-spectrum camera, to scan and measure the wafer's topology. The laser line scanning method used by KLA AIT-XP+ is designed to accurately measure thin-film parameters such as thickness, aspect ratio, and etch rate. The metrology unit of KLA / TENCOR AIT-XP+ features an automated metrology tool. This asset works by scanning the entire wafer and then comparing the resulting data with stored values to ensure accuracy and detect possible defects in the thin-film material. The automated metrology model also includes in-line automatic defect review, allowing operators to quickly and efficiently identify and mark any issues that arise. Finally, the data analysis module provides a comprehensive view of the wafer. This allows operators to detect non-uniformity as well as analyze the complete geometry and yield of each wafer. Data can be stored, and any detected issues can easily be traced to their source. In this way, operators can quickly identify any issues and address them promptly. AIT-XP+ is the ideal choice for inspecting and measuring the surface of thin-film materials found on semiconductor wafers for defects, non-uniformity, and surface roughness. The equipment is designed to meet the demanding needs of both production and research industries. Its sophisticated optics, automated metrology system, and data analysis module reduce wafer processing time and help to minimize the risk of yield losses.