Used KLA / TENCOR Backside Inspection Module (BSIM) for SP1-DLS #9358656 for sale

KLA Backside Inspection Module (BSIM) for SP1-DLS is a specialized wafer testing and metrology equipment designed specifically for backside wafer imaging and inspection. Integrated with the SP1-DLS device, it offers a unique combination of high resolution imaging and precise metrology for a wide range of wafers, including those with ultra-thin device layers. It is used to detect defects and non-conformities in the backside of wafers, and to diagnose issues related to manufacturing processes. The BSIM system is capable of imaging the top and both sides of the wafer in one pass, thereby allowing for reduced inspection time. It uses a proprietary Automated Conductance and Resistance (ACR) imaging technology to easily inspect wafers with large areas of metallization. The unit also features a wide optical field of view and a large sample area, allowing it to cover up to 50 percent of the wafer's diameter in a single scan. Inspection of multiple layers on the backside is enabled via automatic edge detection, featuring a 4-point registration machine which adjusts to measurements of the edge profiles of the D-TEM samples. The tool uses advanced algorithms and highly automated processes to quickly detect defects, such as MICROS and pinholes, and enable analysis on-the-fly. Further, the software employs a hierarchical structure that is adapted to the electrical structure of the D-TEM sample being tested. The asset's strict and reliable metrology capabilities are made possible thanks to its 5-axis motorized stages and piezo-actuated transducers with hardened-shafts that can measure with micron accuracy. Additionally, the samples can be configured for customized measurement types via a variety of interchangeable accessories, such as magnifying lenses, stylet tips, glass slides, and wedge substrates. Designed for high productivity, the BSIM model facilitates real-time diagnostics, detecting and correcting problems with the sample before a wafer is shipped out. It also offers the highest levels of quality assurance and process monitoring, with on-the-fly analysis of wafers with their respective dimensions and depth. Finally, its intuitive graphical user interface allows for operators of different skill levels to work with the equipment with ease.