Used KLA / TENCOR C2C #9187559 for sale
KLA / TENCOR C2C (Critical Dimension and Critical Overlay metrology) is a dedicated solution for automated wafer testing and metrology. It is designed to provide the manufacturer with detailed information regarding the physical structure of semiconductor components (wafers). It is suitable for both mass production and process development environments. KLA C2C equipment uses two advanced technologies in combination for wafer testing and metrology: scatterometry and critical dimension scanning electron microscopy (CD-SEM). Scatterometry is used to measure the critical dimensions of the structures on the surface of the wafer. It uses a combination of a laser and a photodetector to detect changes in the backscattering light from the wafer. This technique is especially useful for measuring fine-pitch patterns on the wafer and for estimating the placement accuracy of individual structures, providing the user with an accurate picture of the structure of the wafer. The second technology employed by the system is CD-SEM. This technique uses a scanning electron microscope to measure the cross-sectional profile of the structures on the wafer. This is done by focusing an electron beam onto a small area of the sample, providing a high-resolution image which is analyzed to determine the precise dimensions of the structures. This is useful for determining tolerances and to monitor potential process variations between lots of wafers. TENCOR C2C unit also provides automated overlay metrology measurements using critical dimension (CD) and overlay missions. The mission enables the user to monitor in-line the performance of overlay structures, providing the user with complete visibility of alignment and critical overlay performance. This is essential for any manufacturer who needs to produce high performance, consistent, and reliable products. The combination of scatterometry and CD-SEM also provides the user with an error budget which can be used for process control and statistical process control in production environments. This increase in process efficiency can reduce the cost of production and the risk of failure in the long run. Finally, C2C machine provides detailed analysis of the patterning on the wafer surface to ensure uniformity and a high quality of production. This includes the analysis of isolated features, lines, and spaces; isolated features on multiple layers as well as features with complex shapes. Overall, KLA / TENCOR C2C is an advanced solution designed to provide the manufacturer with detailed information regarding the physical structure of semiconductor components (wafers). It is suitable for both mass production and process development environments and provides an optimal combination of techniques for determining critical dimensions and overlays. As such, it is a powerful tool for improving the quality, efficiency and cost effectiveness of semiconductor production processes.
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