Used KLA / TENCOR CI-T53P #9254920 for sale

KLA / TENCOR CI-T53P is an advanced automated wafer testing and metrology equipment used to measure, inspect, and analyze a variety of parameters on silicon wafers. It combines the latest metrology technologies, sophisticated motion controls, and powerful process control tools to provide precise and reproducible data for semiconductor device fabrication processes. KLA CI-T53P system offers two major capabilities for wafer analysis: metrology and testing. Its metrology capabilities allow for multiple parameters to be tested in a single wafer, such as thickness, bow/warp, width, and overlay. The unit is capable of measuring overlay within 0.25 microns, making it an ideal solution for monitoring overlay precision in advanced device designs. Additionally, TENCOR CI-T53P can analyze wafers for a variety of mechanical parameters, such as flatness, surface roughness, and particle contamination. CI-T53P machine is also equipped with a full suite of tests that can be performed during a single cycle. One such test is the photo defect inspect (PDI), which precisely measures the location, size, and shape of photolithography patterns on the wafer. Another example is critical dimension imaging (CDI), which can be used to accurately measure fine line widths and other device features. These tests help to ensure that the wafers produced are defect free and that device characteristics are within limits. KLA / TENCOR CI-T53P tool is designed to provide precise and reproducible data to operators. This is enabled through an intuitive asset interface that allows for the integration of various accuracies when utilizing various test tools. Additionally, KLA CI-T53P integrates advanced statistical process control (SPC) tools in an effort to ensure the results of each test are within the desired range. This enables a wide range of capabilities for traceability, predictive analysis, and maintenance of wafer processes. Overall, TENCOR CI-T53P is a powerful wafer testing and metrology model designed to provide superior accuracy, precision, and reproducible data in the semiconductor device fabrication process. Its advanced capabilities enable operators to manage and control the various parameters of wafer testing more effectively.