Used KLA / TENCOR eRanger 5200 #293621220 for sale
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ID: 293621220
Wafer Size: 12"
Vintage: 2010
SEM Defect review system
(2) Load ports
Chamber.
KLA / TENCOR eRanger 5200 is a wafer testing and metrology equipment designed to provide complete process control for advanced semiconductor device manufacturing. Developed with the latest in semiconductor manufacturing technology, the eRanger system is designed to provide precise wafer thickness, shape, and profile measurements with high accuracy and repeatability. The unit's advanced optics and integrated microelectromechanical systems (MEMS) enable it to perform metrology on both the front side and back side of the wafer, along with area scan measurements with full detail. The eRanger features automated measurements on both Flip Chip and Wirebond wafers. Its advanced optics allow it to capture and measure both soft and hard masks in 1-micron resolution per shot while providing ion beam images of up to 10 microns. The machine's 3D profilometry capabilities can measure wafer diameters and bevel angles, radius curvature, rims and steps, all in 1 micron resolution. It also enables the measurement and analysis of pad height and flatness parameters, facilitating layout, metrology, and process control. The tool is also capable of measuring process-induced defects such as metal line width, pitch, and corner radius. Its unique robust process design enhances wafer control and reduces the risk of particle addition and contamination. The high-throughput 8-inch optical asset is fully compatible with most wafer processes, enabling optimized line-of-sight measurements between wafer and sample. This enable the eRanger model to ensure sufficient and repeatable wafer-to-sample alignment and position repeatability during measurement cycles. KLA eRanger 5200 equipment is an excellent choice for businesses seeking to save costs and reduce variance in their semiconductor manufacturing processes. It is robust, easy to operate, and provides reliable, high-accuracy measurements with repeatability and accuracy in the micron range. The system actively reduces the risk of contamination and provides comfortable and ergonomic operation for operators. Finally, its compatibility with most wafer processes makes it an excellent choice for any semiconductor manufacturing facility.
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