Used KLA / TENCOR Flexus 2320 #9268289 for sale
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ID: 9268289
Thin film stress measurement system
Wafer capability: Up to 6"
Laser scanning to measure stress with reflecting films
Measures and displays stress
Data analysis capabilities
Plotting for Statistical Process Control (SPC)
3-D Map of wafer deflection entire surface
Bi-axial modulus of elasticity and linear expansion
Water diffusion co-efficient dielectric films
With linear regression
Stress-temperature / Stress-time gradients
Stress with very low measurement noise
Stress relaxation oxide densification
Phase transformations and annealing
Power supply: 230 V, 50/60 Hz, 30 A, Single phase.
KLA / TENCOR Flexus 2320 is a wafer testing and metrology equipment for the semiconductor industry. It is designed for the high-volume testing and analysis of wafer substrates used in semiconductor production. The system offers a wide range of capabilities, from automated optical inspection (AOI) to advanced defect review and metrology. KLA Flexus 2320 includes two independent electron beam systems, each with a unique set of capabilities. The two systems are used together to test and analyze wafer substrates, and the results are seamlessly integrated for comprehensive defect review evaluation. The primary electron beam unit is used for surface and subsurface structural imaging, defect review and micro-compositional analysis. The secondary electron beam machine is dedicated to defect metrology, including critical dimensions (CD) and overlay measurements. TENCOR Flexus 2320 provides an array of advanced imaging capabilities to identify and diagnose defects. These include bright-field imaging, dark-field imaging, backscatter imaging, and automated optical inspection (AOI). The tool's automated defect review process further enhances imaging and analysis, filtering out non-defects while targeting real defects. Defects can be characterized and analyzed using Flexus 2320's automatic defect classification (AFC) asset. Advanced capabilities such as digital maps and feature isolation enable more accurate defect localization. The secondary electron model of KLA / TENCOR Flexus 2320 provides critical dimension (CD) measurements with outstanding accuracy. It features an optical microscope that enables an operator to mark inspection areas with high precision. CD measurements can be taken over the entire wafer substrate and used to generate cross-sectional images for further analysis. In addition, the equipment includes proprietary overlay measurement and metrology capabilities. KLA Flexus 2320 offers comprehensive wafer testing and metrology capabilities in a single platform. Its automated optical inspection (AOI) and defect characterization capabilities provide rapid and accurate defect diagnosis and localization. Its advanced metrology capabilities enable high precision CD measurements and overlay analysis. The system is an invaluable asset in the semiconductor industry, enabling reliable and cost-effective wafer testing and analysis.
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