Used KLA / TENCOR FLX-2320 #293606030 for sale

KLA / TENCOR FLX-2320
ID: 293606030
Thin film stress measurement system.
KLA / TENCOR FLX-2320 is a state of the art wafer testing and metrology equipment designed to provide unparalleled accuracy and resolution for precise analysis of nanoelectronic wafers. KLA FLX-2320 uses a 5-axis scan head to interact with the wafer under test, enabling precise measurement and analysis of precise device components on the wafer surface. TENCOR FLX 2320 provides an integrated suite of advanced imaging technologies to provide detailed visualization of wafer defects. The system's optical unit uses 4x magnification with a 3-inch diameter field of view, allowing for precise analysis of the entire wafer surface. FLX-2320 provides both bright-field and dark-field imaging with signal-optimized light deployment, enabling multiple image types from a single scan. FLX 2320 also incorporates variable-angle signal diffraction (VSD) for complex device measurements, enabling precise evaluation of nanoelectronic structures and devices. This machine is configured with an exclusive high voltage capacitively-coupled optical metrologyStage (HCOMS) to gather a full range of data points with a superior signal-to-noise ratio. KLA FLX 2320 has an integrated wafer handling tool with a comprehensive wafer load/unload sequencer. The integrated BLSS-5 yield management asset uses self-learning algorithms to separate acceptable and reject devices, ensuring a high rate of yield. All measurements taken with KLA / TENCOR FLX 2320 are stored in a secure and accessible database, allowing for automated and real-time data access. TENCOR FLX-2320 also employs a suite of advanced in-situ defect inspection, mapping and characterization technologies. These tools allow for the integrated analysis and visualization of tiny defects, resulting in more accurate wafer defect detection and enhanced quality assurance. KLA / TENCOR FLX-2320 also utilizes a comprehensive suite of advanced in-situ defect characterization tools. Support for automated defect tracking, device location and device analysis provide advanced defect analysis capabilities, enabling precise identification of defect causes. KLA FLX-2320's high precision optics and scanning capabilities enable unprecedented levels of wafer testing and metrology. This model drastically improves the efficiency and accuracy of the wafer-testing process while significantly reducing production costs. TENCOR FLX 2320 is one of the most advanced wafer testing and metrology systems on the market, providing the highest level of performance, accuracy and resolution in the industry.
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