Used KLA / TENCOR FLX-2320 #9292632 for sale

KLA / TENCOR FLX-2320 is a wafer testing and metrology equipment developed with the purpose of improving IC fabrication operations through advanced metrology performance, accurate data, and reliability. KLA FLX-2320 has a unique optical wafer measurement architecture that delivers speed and accuracy in a compact footprint. This architecture incorporates one-time autofocus capabilities, high-speed X-drive positioning technology, automated metrology functions and advanced CCD imaging sensors. The advanced CCD imaging sensors are engineered to yield high-resolution and wide-field image-capturing capability, allowing the system to measure different types of wafer features simultaneously with accuracy and repeatability. TENCOR FLX 2320 also features advanced one-time autofocus capabilities that allow the unit to precisely and quickly adjust the focus of the wafer, enabling higher throughput of the wafer measurement process. Additionally, the high-speed X-drive positioning technology ensures fast, precise, and random motion of the wafer stage. TENCOR FLX-2320 machine is designed with robust automation capabilities that eliminate tedious job setup and data reporting tasks, resulting in streamlined operations. This tool also includes an interactive PC workstation with Windows-based software that enables easy on-screen control over tradeoff functions and data analysis. Additionally, an advanced wafer-level alarm feature provides real-time decision-making for continuous process optimization. KLA / TENCOR FLX 2320 asset is capable of measuring arbitrary patterned substrates, displays and substrates with opaque layers, and 3D surfaces and structures. Furthermore, with fully offline wafer inspection capabilities, users can inspect wafers without the need for additional expensive equipment. Finally, the model meets industry standards, including SEMI and US Conformity Assurance Level 1 (CAL1). In summary, FLX 2320 is a powerful wafer testing and metrology equipment that can be used to improve IC fabrication operations. It features advanced one-time autofocus capabilities, high-speed X-drive positioning technology, and CCD imaging sensors that can measure a variety of wafer features in an accurate and repeatable manner. Additionally, the system offers robust automation capabilities, Windows-based software, and a wafer-level alarm feature to further streamline operations.