Used KLA / TENCOR FLX-2900 #193367 for sale
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ID: 193367
Thin film stress measurement system, 4", 5", 6"
Temperature range: room to 900°C
Scan range: user programmable up to 6"
Minimum scan step: 0.02mm
Maximum points per scan: 1250
Measurement:
Speed: 5 sec for 6" wafer
Range: 2x10^7 for 80mm scan length to 2x10^10 dyne/cm2 (Stress upper limit increases with shorter scan length)
Repeatability (1 omega): 1x10^7 dyne/cm2 for 80mm scan length
For typical 525 um wafer with 10,000A film
RMS noise: <0.0001 l/m (radius = 10,000m) at room temperature
Minimum radius: 3.8m.
KLA / TENCOR FLX-2900 is a wafer testing and metrology equipment that has become the industry standard for the characterization of thin films, texturing, and dimensional measurements. It provides advanced capabilities to measure the most challenging samples, including active and passive layers of various materials, patterned wafers, and wafelets. The system features an extension-tilt wafer stage design coupled with a high-precision reflective motion unit for improved imaging and measurement accuracy. This ensures unmatched uniformity for the measurement of films used in the semiconductor industry, such as metal wiring, spacers, and contact layers. For robust testing, KLA FLX-2900 offers an advanced detection and segmentation algorithm that automatically identifies and differentiates between a variety of materials. The machine utilizes a proprietary 3D measurement module with high sensitivity to accurately characterize nanostructure. It also utilizes advanced pattern recognition techniques to perform measurements on patterned wafers with traceability. In addition, TENCOR FLX-2900 includes a flexible process library that allows users to create their own customized tests and process sequences. These sequences can be stored and recalled quickly and easily. In addition, the tool offers an automated library of conditions, as well as a scan path optimization tool for rapid and accurate results. The asset is packaged in a compact design to provide flexibility for the user. It provides an easy-to-read interface to allow users to manage multiple tests with ease. With a wide range of evaluation conditions, FLX-2900 gives users precise and accurate results while allowing them to easily identify issues and take corrective action. KLA / TENCOR FLX-2900 is a powerful tool that provides precise and reliable results. The model's advanced capabilities, flexibility, and expansive measurement features make it the perfect choice for the characterization of thin films, texturing, and other dimensional measurements. This equipment is the perfect solution for any wafer testing or metrology application.
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