Used KLA / TENCOR HRP 260 #293628462 for sale

KLA / TENCOR HRP 260 is a wafer testing and metrology equipment that utilizes optical metrology and image analysis to perform accurate and precise measurements of wafer geometry, wafer thickness, and surface topography of semiconductor wafers. The system is composed of several components, including a measurement head, optically aligned Test Tool, and an automated XY motor stage with integrated thermal zone isolation; these components work together to measure the characteristics of the device with exceptional accuracy and repeatability. The heart of the unit lies in the integrated Optically Aligned Test Tool, which combines specialized RGB lighting, multiple objectives and several motion axes. The Test Tool enables fast and precise measurements of wafer surface topology, wafer thickness, wafer flatness, wafer levelness, wafer center position, and device-level flatness. The Test Tool is capable of measuring a variety of wafers ranging from 200mm to 300mm in diameter, and is capable of automatically measuring up to 200 features on a single wafer. In addition to the Optically Aligned Test Tool, KLA HRP 260 also contains an automated XY motor stage with embedded thermal zone isolation. This stage is designed to support the Test Tool's motion axes, as well as provide protection from thermal drift and vibration. TENCOR HRP 260 provides the user with a comprehensive suite of measurement capabilities. It supports open-loop and closed-loop automatic measurements, and is able to simultaneously measure the surface topology, center offset, and flatness of each wafer. By combining traditional optical techniques with laser-based techniques, the machine is capable of delivering maximum accuracy and precision. The tool is equipped with a real-time data collection module that collects and stores all collected data in real-time and then forwards it to an onboard processing unit. This unit is responsible for analyzing the data and generating a variety of reports that are used to ensure compliance and identify issues. HRP 260 also features a simple user interface that provides the user with easy access to the measurement results and allows them to quickly and easily monitor asset performance. Overall, KLA / TENCOR HRP 260 is an advanced wafer testing and metrology model that utilizes optical metrology and image analysis techniques to provide accuracy and precision when measuring the characteristics of semiconductor wafers. The equipment supports open-loop and closed-loop automatic measurements, collects data in real-time, and generates several different types of reports for regulatory compliance and performance monitoring.