Used KLA / TENCOR HRP 340 #293794170 for sale

KLA / TENCOR HRP 340 is a wafer testing and metrology equipment designed for non-destructive, high-resolution physical inspection of semiconductor wafers. This advanced wafer testing system utilizes multiple cameras and a digital imaging technology to accurately measure and detect electrical, mechanical, and optical defects on the wafer surface. Its physical inspection capability supports wafer inspection of up to 380mm wafers with a resolution of 0.25μm and depth of focus of up to 4.5μm which helps identify particles, scratches and other defects on wafer surfaces. The unit also has the capability to inspect multiple dies on a wafer at a time. The inspection of multiple dies on a wafer is accomplished by its automated focus engine, motorized XY stage, and an integrated imaging machine which helps to provide fast and accurate result. KLA HRP 340 offers a wide range of options for defect detection, measurements and characterization. It includes various electrical tests such as DC biasing, capacitance measurements and resistivity measurements, as well as measurements for line width, edge count, polygonal count, CCD pixel count, and leakage current. Furthermore, it also offers optical tests such as surface analyzing, defect and film thickness detection, and particle analysis and identification. Its imaging capabilities include SEM, STM, TEM and high magnification imaging. Its motorized XY stage helps to minimize die position shift across various test points, thus ensuring better repeatability and reproducibility of results. The tool is integrated with advanced software which is designed in line with industry specific requirements and provides reliable data for analysis and reporting. Built with an intuitive user interface, the software bundles an effective data management and SPC (Statistical Process Control) solutions. It also includes SEMI compliant recipes which aid to generate useful reports meeting industry standards. TENCOR HRP 340 is the ideal choice for high resolution inspection of semiconductor wafers in wafer testing and metrology applications. Its advanced features and capability make it perfectly suited for advanced die level metrology and characterization which speed ups the process of wafer testing and metrology.