Used KLA / TENCOR HRP 340 #9383060 for sale

KLA / TENCOR HRP 340 is an automated wafer testing and metrology equipment that enables production fabs to quickly and accurately measure both planar and dimensional parameters of microelectronic semiconductor wafers. It is suitable for measuring dynamic variables (width, thickness, surface topology, etc.), providing various metrology and electrical applications, and ensuring measurements are extremely accurate and reliable. The system utilizes advanced image processing and pattern recognition techniques. The unit includes a stage, a sample holder, a wafer-orientation station, a rotary table, and advanced vision processing and measurement algorithms. To initiate the measurement process, the machine places the horizontal stage in the home position. Next, the operator places a wafer on the sample holder and manually moves it to one of several orienting positions. Once the wafer is in place and properly oriented, the rotary table rotates, automatically adjusting the wafer to a fixed number of test positions. At each test position, the tool senses the wafer features and measures both planar and dimensional features using a combination of imaging and force-sensor technology. The asset then translates and rotates the wafer back to its original orientation and prepares the stage for the next wafer to be measured. After the cycle is complete, the model stores the measured data in RAM or to an external device for further analysis. KLA HRP 340 is equipped with four processing tools for various purposes, including Focus-in-Place both Forward Scatter Illumination (FSI) and Through-the-Lens (TL) for measuring a wide variety of planar features. It can detect features across the entire wafer while accurately controlling focus. Electrode Tip Angle (ETA) is a tool used for the evaluation of dimensional profile. Substrate Profile (SP) tool is used to measure the vertical profile of the wafer while it is on the stage. The Total Thickness Tool (TTT) is designed to measure the total wafer thickness, as well as other dimensional parameters. TENCOR HRP 340 enables robust and repeatable wafer testing and metrology, resulting in accurate and productive processes across production fabs. It is designed to meet high-volume requirements, reducing costs and ensuring measurements meet the highest quality standards. Additionally, the equipment is capable of simultaneous metrology on multiple wafers and wafer lots, which further increases the efficiency and speed of production.