Used KLA / TENCOR / ICOS T830 #9223924 for sale
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ID: 9223924
Vintage: 2016
Fully automatic inspection system
P/N: 0526600-000
xPVI: Top & bottom
3D Wave
Gull wing 3D inspection
Component height measurement on BGA
Component height caliber (11.25 x 11.25 x 1.2)
Component height caliber, TBD
SPC & Image review tool
Unit level traceability (Datamatrix)
OCR Verification on mark teach
Directional grouping
Advanced QFN2D/5S parameters
Advanced metrology
5-Lanes with (4) single reject trays
XY Automated dual row
Automated (4) inline sorting heads
Pocket integrity check
(5) Ionizer kits
(40) Pads, TBD
USB Barcode scanner
Vacuum pen kit
Tray orientation kit
(28) Nozzles
O-Ring, diameter 3.5 mm
Display, 22"
P/N: 0595046-000, Dent module
5S BGA/QFN Matrix mirror block
P/N: 0597136-000 System, OS test handler
P/N: 0602634-000 Kit, T8x0 OS docking
OS6 Conversion kit
P/N: 0616633-000 Upgraded T8x0R1, integrated tray bar code reader
Top DOL/FLB on IS2
P/N: 0613954-000 Kit, slim btm brushing, T8x0
P/N: 0603462-000 Kit, T8x0, light curtain
2016 vintage.
KLA / TENCOR / ICOS T830 Wafer Testing and Metrology Equipment is a versatile, fully automated metrology platform designed for the characterization of single wafer and reticle scale devices. The system enables fast, accurate, and precise data collection at each stage of wafer metrology, enabling better device characterization and yield optimization. KLA T830 uses multiple non-destructive optical metrology techniques to measure both device wafer size and features within a single device. The unit enables near real-time parallelism to determine device sizes in areas up to 500 mm in diameter, permitting extremely wide area coverage even in device structures that may exhibit variable photolithography processing and other effects. Measurement options such as focus and exposure, surface topography, and defect detection provide further characterization parameters. The machine incorporates advanced image processing algorithms for maximum accuracy, and also enables high throughput run rates. Automation capabilities integrate measurement data and process control data from multiple sources at the same time, initiating new test paths and generating alerts for quality control purposes in real-time. The design incorporates advanced platform control functionality, including memory and hardware validation testing. ICOS T830 Wafer Testing and Metrology Tool allows for simultaneous measurement of device parameters such as critical dimensions, resistivity, planarity and defect detection. The asset obtains measurements from multiple metrology tools that can range from critical dimension scanning electron microscopes to optical profilometers, allowing for the production of high resolution 3-D maps of device features. In combination with additional modules such as KLA TSSI (Test Structured Support Interface), the model provides comprehensive visual design analysis support by producing statistics on test structures such as surface topography, metrology data analysis techniques, and in-depth reliability analysis. Integrated data storage and analysis allows root cause analysis to be performed in cases where a defect occurs in a device structure. The modular design of TENCOR T830 Wafer Testing and Metrology Equipment facilitates device compatibility by allowing compatibility testing against multiple devices in a single architecture. With highly optimized software platforms, the system delivers high performance imaging, data retrieval, and analysis. With multiple processes running concurrently, the unit is capable of generating actionable results in a matter of minutes. T830 Wafer Testing and Metrology Machine is an advanced wafer testing and metrology technology designed to quickly and accurately provide valuable insights about device parameters. The tool provides the flexibility, accuracy, and speed needed for modern device testing, and its advanced features enable comprehensive device characterization.
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