Used KLA / TENCOR / ICOS T830 #9227750 for sale
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ID: 9227750
Wafer Size: 12"
Vintage: 2015
Fully automatic inspection system, 12"
P/N: 0526600-000
xPVI: Top & bottom
3D Wave
Gull wing 3D inspection
Component height measurement on BGA
Component height caliber (11.25 x 11.25 x 1.2)
Component height caliber, TBD
SPC & Image review tool
Unit level traceability (Datamatrix)
OCR Verification on mark teach
Directional grouping
Advanced QFN2D/5S parameters
Advanced metrology
5-Lanes with (4) single reject trays
XY Automated dual row
Automated (4) inline sorting heads
Pocket integrity check
(5) Ionizer kits
(40) Pads, TBD
USB Barcode scanner
Vacuum pen kit
Tray orientation kit
(28) Nozzles
O-Ring, diameter 3.5 mm
Display, 22"
P/N: 0595046-000, Dent module
5S BGA/QFN Matrix mirror block
P/N: 0597136-000 System, OS test handler
P/N: 0602634-000 Kit, T8x0 OS docking
OS6 Conversion kit
P/N: 0616633-000 Upgraded T8x0R1, integrated tray bar code reader
Top DOL/FLB on IS2
P/N: 0613954-000 Kit, slim btm brushing, T8x0
P/N: 0603462-000 Kit, T8x0, light curtain
2015 vintage.
KLA / TENCOR / ICOS T830 is an advanced wafer testing and metrology equipment designed for highly precise measurements of transistors, resistors, and capacitors on both complete wafers and individual die. Its design allows for extremely accurate and repeatable measurement of single transistors, as well as testing of complex devices such as multiplexers, shift registers, and logic functions. KLA T830 system comes with an integrated serial high-resolution camera, which features 4K digital imaging with full frame-rate video capture capabilities. It allows for precise inspection and measurement of contained structures on complete wafers and individual die. Its state-of-the-art design includes an eight inch high-speed scan stage, which is capable of scanning up to 1200 die per second. The scan stage's resolution of 10 microns accurately captures the complete die surface, providing off-axis, cantilever, and die-by-die measurements of all transistor types. Additionally, its 3-dimensional device measurements are used to characterize current, power, and voltage performance of both single and complex structures. ICOS T830 unit also comes with a pattern recognition and image processing module, designed to quickly analyze, edit, and detect defects on high-resolution wafer images. The machine utilizes the latest imaging technology to accurately locate and categorize wide-ranging circuit features, allowing for extremely accurate and precise diagnosis of found defects. In addition, TENCOR T830 tool also features powerful performance modeling and analysis (PMA) functions. Designed to help predict and evaluate circuit performance, its six modules provide comprehensive solutions for inspecting design rules, timings, power, current, voltage, and more. These functions, combined with its advanced visualization tools, are used for both real-time analysis and offline analysis of various circuit metrics. T830 is one of the most advanced wafer testing and metrology systems on the market today. With its integrated 4K camera, powerful scan stage, pattern recognizer, and comprehensive PMA performance model, it provides unique capabilities to accurately analyze, measure, and diagnose a variety of devices that are suited for a variety of applications.
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