Used KLA / TENCOR P12 #9296518 for sale

KLA / TENCOR P12 Wafer Testing and Metrology Equipment is a robust, easy-to-use metrology and testing solution that provides high-speed, accurate, and reliable data for production line control. Its broad capabilities include broad front-end inspection, tests, and metrology needs such as pattern measurement, identification and classification, device characterization, wafer alignment, and edge inspection. KLA P 12 System uses a range of technologies to provide reliable, repeatable and accurate results for a variety of process control and device qualification applications. For example, TENCOR P-12 has the capability to measure physical, electrical and layout parameters with high resolution. It is also equipped with a real-time imaging unit capable of four-axis alignment and provides data for metrology accuracy, yield improvement and process control. P-12 Machine is well-suited for improving quality and throughput with its advanced digital signal processing (DSP) technology. It includes a powerful embedded processor for real-time digital signal processing for high-speed data measurement and accuracy. An extensive library of algorithms enables easy configuration and fast deployment. TENCOR P 12 also features automated wafer detection, edge detection, and particle inspection. P 12's high throughput tool architecture allows multiple process and device tests to be executed simultaneously, while providing sophisticated pattern recognition capabilities. Additionally, KLA / TENCOR P 12's advanced data analytics and pattern classification allow users to manipulate and visualize results quickly and accurately. KLA P12 Wafer Testing and Metrology Asset is a reliable and accurate solution for production line control. It can be configured and deployed quickly to enable process and device testing while facilitating pattern recognition and data visualisation. Furthermore, its broad capabilities include front-end inspection, tests, and metrology needs such as pattern measurement, identification and classification, device characterization, wafer alignment, and edge inspection.