Used KLA / TENCOR P-7 #293632302 for sale

ID: 293632302
Film thickness measurement system.
KLA / TENCOR P-7 is a wafer testing and metrology equipment designed for advanced semiconductor device production. It offers a comprehensive metrology suite that allows operators to evaluate on-wafer parameters such as film thickness, line width, overlay, and transistor performance. It provides an integrated, automated, and repeatable way to precisely characterize wafer features in a rapid, non-invasive manner. Built with advanced optics and hardware, KLA P-7 offers superior resolution, speed, and reliability. To achieve this performance, the system employs multi-channel, multi-function illumination techniques to measure and analyze features on the wafer surface quickly and reliably. The high-resolution imaging unit automatically detects defects, characterizes critical dimension, and performs FIB imaging for quick analysis. It can also readout large dies (300mm) with high precision. At the same time, the machine has an advanced pattern matching algorithm that supports pattern recognition and die-to-die matching across large areas. TENCOR P 7 is able to acquire and process data quickly and accurately. Its onboard data processing algorithms and math functions allow to analyze and identify processes for optimizing device performance with considerable repeatability. The tool is also equipped with an intuitive graphical user interface (GUI) with easy-to-understand features and menus. In addition, the asset has a highly efficient built-in thermal management model which ensures temperature stability, accuracy, and control. This ensures the highest accuracy in wafer testing and metrology whatever the temperature. Furthermore, the solution is highly fault-tolerant and fail-safe, making sure that measurements are safe, reliable, and accurate. Overall, KLA / TENCOR P 7 Wafer testing and Metrology equipment is an excellent choice for advanced semiconductor device production. Its integrated solutions, efficient thermal management, and powerful data processing algorithms make it the perfect tool for quickly and accurately measuring and analyzing features on the wafer surface.
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