Used KLA / TENCOR P10 #9248606 for sale

KLA / TENCOR P10 is a sophisticated, automated wafer testing and metrology equipment used to identify and characterize semiconductor wafers in leading-edge technology nodes. This system works by optically scanning high-resolution images of each wafer to detect process-related defects. In addition, KLA P-10 unit offers advanced data analytics capabilities to build inspection models that can detect even the smallest defects. The main components of TENCOR P 10 machine are the block diagram processor (BDP), the laser imaging subsystem (LIS), the optical subsystem, and the metrology subsystem. The BDP is a specialized component that controls the various components of TENCOR P10 tool and processes the results from the LIS and optical subsystems. It is also responsible for the overall operation of TENCOR P-10 asset and for managing the data generated by the model. The laser imaging subsystem (LIS) of P 10 equipment consists of a pulsed laser, a scanning stage, and a telecentric lens. This subsystem provides automated, high-resolution imaging of the wafers that can detect even the smallest defects. The laser used in the LIS is typically a wavelength of 515 nanometers, which is sensitive to a wide range of defect characteristics, including those associated with process-related defects. The optical subsystem of KLA P 10 system is responsible for the interpretation and analysis of data obtained from the LIS. This subsystem contains two main components: the defect monitor and the color monitor. The defect monitor is used to identify process-related defects on the wafers. The color monitor is used to measure color variation between different wafers. The metrology subsystem is a data analysis tool that takes the data generated by the LIS and applies mathematical algorithms to extract information about the wafer's defect characteristics. This subsystem can be used to develop models that identify even the slightest process-related defects. P10 unit is an extremely powerful tool for identifying process-related defects. It combines high-resolution imaging, sophisticated algorithms, and powerful data analytics capabilities to provide a comprehensive solution for quality control in advanced technology nodes. This machine can be used to ensure high yields and robust product performance, which is essential in the highly competitive semiconductor manufacturing industry.