Used KLA / TENCOR P11 #293809525 for sale

KLA / TENCOR P11 is a wafer testing and metrology equipment that combines both test and metrology capabilities into a single, integrated platform. This system is designed for wafer level screening and reverse engineering applications. KLA P-11 unit operates using image recognition and pattern recognition technology to detect faulty features on a wafer or substrate. It can also measure the electrical and physical characteristics of wafer devices and provide information on die location, defects and an array of other parameters. TENCOR P 11 uses a variety of measuring techniques, including imaging, 2D measurements, critical dimension (CD) measurements, electrical testing (electrical test and retest), critical area analysis and advanced defect analysis. It also offers advanced 3D mapping and profiling capabilities, as well as advanced defect detection techniques. KLA / TENCOR P 11 spectroscopic imaging technology can be used to detect and distinguish different types of defects and topological features. It also supports a variety of non-destructive electrical testing techniques, such as CVU, IVu and OD measurement. TENCOR P-11 machine is equipped with an advanced fiducial alignment tool for die autolocation, simplifying operation of the asset and maximizing alignment accuracy. KLA / TENCOR P-11 is also capable of handling up to 500 wafers per hour with 4 lid-side wafer carriers. Advanced image analytics on P11 allow for rapid defect identification, including microscopic defects, large open sites, scratches and other topographic defects. In addition, the model includes comprehensive pattern recognition algorithms to compare the inspected structures to known patterns stored in its library. P-11 also provides a range of statistical data analysis tools, such as mean and standard deviation, maximum, minimum and histogram analysis. With its real-time reporting and user-defined reporting modules, it provides in-depth analysis on trends and statistics. Finally, TENCOR P11 equipment is designed for precise defect localization and can localize defects with an accuracy of 1 um over an area of 100 um x 100 um. It also offers a wide range of automation options, with its robotic handling systems, multi-die pickup system, automated testing solutions and its automated metrology solutions.