Used KLA / TENCOR Puma 9130 #9398548 for sale

KLA / TENCOR Puma 9130 is a precision metrology and wafer testing equipment designed for production level wafer testing and metrology. The system is capable of highly accurate measurements and testing of wafers with a typical accuracy of 1.2 nm. The unit is capable of measuring multiple configurations of wafers and can scan up to six inch in diameter. KLA Puma 9130 is a fully automated machine that allows users to quickly and accurately analyze, inspect, diagnose and repair semiconductor wafers and chips. TENCOR Puma 9130 features a proprietary software platform, allowing users to configure and control all aspects of the tool's operations. The asset is powered by a 12 channel optical microscopic camera and a three-axis motion model that provides high resolution imaging, allowing precise measurements and analysis of wafer features. Puma 9130 features a high resolution image processing equipment to obtain data from images. This system can be used to detect, measure and analyze wafer features such as critical dimension, line width, edge placement and shape activity. The unit also provides wafer mapping to enable precise measurements of semiconductor chips. The machine is also equipped with a production-level automated defect detection tool. This asset uses a sequence of image processing operations to detect defects such as broken lines, open vias, missing bumps, and various other defects. In addition, KLA / TENCOR Puma 9130 includes a set of image analysis tools that enables accurate analysis of data from images. This includes high resolution semiconductor feature detection, wafer-level defect analysis, pattern contours and surface profiles, and high-level metrology maps. This allows users to obtain precise measurements of critical dimensions and shapes of wafer features. Overall, KLA Puma 9130 is a production-level wafer testing and metrology model that enables precise analysis and inspection of semiconductor wafers. The equipment features high resolution image processing, defect detection, image analysis and metrology mapping capabilities, allowing users to obtain highly accurate data from wafers. This makes the system an ideal choice for production-level wafer testing and metrology.