Used KLA / TENCOR Puma2 #293614936 for sale

KLA / TENCOR Puma2 is a revolutionary wafer testing and metrology equipment designed to significantly improve chip manufacturers' process yield, productivity and cost competitiveness. By using a patented technology called Wafer Stress Metrology2 (WSM2), KLA Puma2 allows chip manufacturers to accurately measure the effects of stress on each chip, providing unprecedented insight into yield before the wafer is even shipped. The system comprises a mainframe, wafer handling modules, optical imaging systems and measurement unit components. The mainframe consists of a processing electronics and storage subsystems, computer vision subsystems, carrier and alignment services and a WSM2 platform. The wafer handling modules consist of high-speed transfer devices and robotic arms for motion, sample preparation, sorting and alignment. The optical imaging systems feature digital cameras and light sources, and the measurement machine components include high-speed contact imaging scatterometry, eddy current testing and other on-wafer test systems. TENCOR Puma2 utilizes a patented architecture called WSM2 that enables precise measurements of stresses in chips in three dimensions. This reduces test time and increases accuracy, enabling chip makers to better understand the die-level stresses across the wafer and make proactive adjustments before shipping the wafer. Moreover, Puma2 delivers rapid feedback and real-time monitoring of each kind of layer in the chip. The tool also performs precise, split-second sub-cycle metrology measurements that provide unparalleled insight into the effects of stress on wafer features. In addition, the asset is highly flexible and can be adapted to any existing chip feature size or profile. It is designed to work with a wide range of standard industry test methods, and customers can program user-defined test parameters to ensure precise measurements. The model's robustness and reliability allow chip makers to maximize yield and productivity, resulting in significant savings of time, cost and energy. Overall, KLA / TENCOR Puma2 is a revolutionary wafer testing and metrology equipment that provides unprecedented insights into wafer stress, enabling chip makers to maximize yield, productivity and cost competitiveness. The system's unique WSM2 architecture and precise measurements in three dimensions allow chip makers to quickly identify issues and make proactive adjustments before shipping the wafer, saving significant time and resources.