Used KLA / TENCOR SFS 7700 #9134040 for sale

ID: 9134040
Wafer Size: 8"
Particle inspection systems, 8".
KLA / TENCOR SFS 7700 is a high-precision wafer testing and metrology equipment that offers unmatched accuracy, speed and reliability to produce consistent wafer-level results for advanced device characterization. KLA SFS 7700's capability to measure a wide variety of parameters on thin-film and thick-film wafers at a single test station leads to increased throughput and improved production yields. TENCOR SFS 7700 is powered by proprietary, tightly integrated software packages designed specifically for wafer testing and metrology applications. The advanced wafer analysis and yield improvement capabilities of the advanced software modules enable users to quickly identify even small variations in wafer performance and reliability and optimize production processes to take advantage of the data. SFS 7700's capability to accurately measure a wide variety of wafer parameters in situ enables users to quickly capture accurate wafer and device-level data with higher throughput, low-cost accuracy and improved throughput than other test and metrology systems. With its advanced Automated Inspection Management (AIM) system, users have the ability to establish and automatically store up to 10 recipes for easy recall and automated operation. KLA / TENCOR SFS 7700 offers breakthrough performance at a competitive price with uncomplicated, intuitive operation for faster start-up with repeatable results. The Scanning Electron Microscope unit provides users with a wide range of automated capabilities for easy to operate, turnkey operation. Additionally, the machine offers a configurable, class-leading Contour Analysis feature which provides the capability to measure nanoscale features with an accuracy of 5nm. KLA SFS 7700 redefines the industry standards for wafer testing and metrology with its strengthened and integrated infrastructure, providing users with an unprecedented level of control, flexibility and accuracy. With enhanced data collection, support for more parallelism, improved scheduling optimization, and more, users now have the power to pinpoint the root cause of a problem with pinpoint accuracy.
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