Used KLA / TENCOR SFX 100 #293761850 for sale

KLA / TENCOR SFX 100
ID: 293761850
Wafer Size: 12"
Vintage: 2005
Thickness measurement system, 12" 2005 vintage.
KLA / TENCOR SFX 100 is a wafer testing and metrology equipment, designed to be used in semiconductor manufacturing. It assists with the process of measuring defects in wafers, typically at the test and sort stages. The system uses advanced imaging and spectroscopic techniques to enable it to identify and analyze defects. It helps to ensure that the wafers pass quality control and meet all relevant standards. KLA SFX 100 utilizes two scanning techniques to analyze wafers: bright-field imaging and scattering contrast microscopy. Bright-field imaging is a relatively simple imaging technique, which scans a lighted surface in different directions and records the light reflected from the surface onto a digital camera. Scattering contrast microscopy uses more sophisticated techniques, looking for differences in the wave properties of particles, such as scattering and absorption, to identify and isolate a defect. TENCOR SFX 100 is specifically designed for efficiency and accuracy. It features high speed part recognition, image analysis and defect classification, and is capable of analyzing up to 2,000 wafers per hour. In addition, the unit utilizes a tilted wedge interface that provides views from different angles which assist with defect recognition. This level of rapid automation is especially beneficial for large wafer lots, as it reduces the time needed for testing. The machine also comes with advanced sensing capabilities which dramatically reduce false alarms and down testing. It can detect the size, position and shape of defects, as well as their shape, depth, level of contamination, type of material, and defect type. This allows the tool to accurately identify true defects, thus significantly optimizing yield and quality assurance. In conclusion, SFX 100 is an advanced wafer testing and metrology asset that enables semiconductor manufacturing processes to be more efficient and accurate. The model is capable of rapidly scanning large wafer lots, accurately detecting and isolating defects, thus improving overall quality assurance and yield.
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