Used KLA / TENCOR UV 1050 #9247774 for sale

KLA / TENCOR UV 1050 wafer testing and metrology equipment is the leading metrology tool for critical advanced packaging applications. This system leverages advanced optics including ozone-attenuated ultraviolet (UV) laser illumination and advanced imaging techniques for accurate defect detection on wafers and substrates. KLA UV 1050 has the ability to work with wafers from 3 inches up to 200mm and provides feature-level defect detection down to 1 μm with a high signal-to-noise ratio. The unit focuses on process control and defect characterization on various leading packaging substrates. It can handle complex and advanced packaging substrates such as fan-in fan-out (FIFO) and through-silicon via (TSV) applications. The imaging machine of TENCOR UV 1050 has superior zoom capabilities to image and inspect features in magnified detail at various levels of magnification. Additionally, its proprietary pattern recognition algorithms enable precise localization and identification of defects to ensure accurate and reliable stage navigation. This tool has an interfacial imaging architecture that provides excellent image clarity and an image capture rate of up to 350 volts per second. This allows for faster edge detection and image acquisition, while the laser spot stability allows for pinpoint accuracy. Additionally, the powerful defect editing and review tools enable precise correction of image alignment and automatic detection and classification of defects. UV 1050 asset also has an integrated, high-performance defect review and classification model, designed to simplify and automate defect analysis and classification. This includes an advanced automatic row-by-row inspection, defect detection, and review capabilities. This inspection ensures accurate defect identification, categorization, and classification. The equipment can also be used to provide comprehensive statistical data on device performance and defect trends, as well as defect tracking. Finally, KLA / TENCOR UV 1050 also offers a range of automated software functions such as discrimination, filtering, sorting, and plotting that allow fast and accurate analysis of defect data. This system is ideal for advanced packaging applications, such as fan-in fan-out, through-silicon via, 3D packaging, and other high-density substrates. Additionally, KLA UV 1050 provides superior defect size measurements with milling and statistical analysis capabilities, which makes this metrology tool ideal for process control and continuous improvement efforts.