Used MATSUBO TMS-2000RC #9394604 for sale

MATSUBO TMS-2000RC is a wafer testing and metrology equipment designed for precisely measuring the quality of wafer surfaces. This system is an integrated solution for providing highly reliable quality assurance data for wafers in various shapes and sizes. TMS-2000RC unit includes an advanced imaging sensor that captures the surface conditions of the wafer with superior accuracy. The machine provides superior high-speed scanning capability, making it suitable for scanning wafers with complex structures such as those used in the semiconductor industry. This allows the tool to effectively capture fine details and more precisely represent the variation of the wafer surface. The asset is also equipped with MATSUBO unique proprietary image analysis algorithm, which can quickly detect and assess surface defects, such as pits or scratches. The algorithms also measure wafer material thickness and analyze the wafer topography, determining its wafer-level variation. The model offers a wide range of measurement and analysis parameters, including the detection of particles, as well as a broad range of scriber marks. Additionally, the equipment also allows for the detection of surface scratches, pits, marks, and indentations, as well as the determination of line width variation measurements and profiles. The system is also designed with user convenience in mind, providing a user-friendly interface and easy operation for efficient wafer characterization. In addition, the unit includes automated alignment features, allowing the user to focus on the measurement task with confidence and trust. Overall, MATSUBO TMS-2000RC is an advanced wafer testing and metrology machine that presents the quality assurance data with outstanding accuracy and reliability. This tool is suitable for various phases of the wafer production process, including wafer inspection, measurement, and analysis. With its extensive range of features and user-friendly operation, TMS-2000RC provides superior results for efficiently analyzing wafer surfaces and providing wafer characterization data.