Used MTI Proforma 300 #9269084 for sale

ID: 9269084
Non-contact thickness measurement system Approximate diameter granite fixture, 8" To hold small / Large substrates.
MTI Proforma 300 is a leading wafer testing and metrology equipment designed to accurately measure and inspect wafers. The system features a 300mm modular design that is easily upgradable, ensuring it stays up-to-date with the latest developments in wafer testing. Proforma 300 unit is based on patented, non-contact electromechanical technology (nominal travel 0.1 µm) for detection of surface defects and topography. The machine includes a digital image capturing camera, scanning head, video hardware and software. MTI Proforma 300 uses a 6-axis stage to provide a travel range of 200mm and 200mm height to enable accurate measurements on any wafer. Proforma 300's defect detection tool uses an array of lasers to detect micron-sized defects, surface roughness, chip placement irregularities and any other non-uniformities in the structure of the wafer. By combining laser and infrared imaging, the asset can detect and measure defects from a wide range of sizes, from 0.1µm to 500µm. The integrated software stores and processes defect data for analysis and evaluation. MTI Proforma 300 also features an advanced 3D mapping model. This equipment provides a high resolution (Z-probe) 3D graphic representation of the wafer surface, allowing users to quickly identify potential defects, structural irregularities and other non-uniformities. The system can capture up to 800,000 measurement points for detailed analysis. In addition, Proforma 300 unit features advanced metrology capabilities, providing high-precision measurement of wafer parameters such as line widths, critical dimensions, pitch and mid-line deviation. The machine also supports operation in a variety of test environments, including benchtop, cleanroom and SEMI Operators Console check. Overall, MTI Proforma 300 offers comprehensive wafer testing and metrology for various industries. The tool is ideal for discovering imperfections, structural irregularities and other non-uniformities in wafers, allowing users to quickly identify and address any issues.
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