Used NOVA T600 #293670542 for sale

NOVA T600 is a state-of-the-art wafer testing and metrology equipment by NOVA Measuring Instruments. It features a high-end probing system that can precisely measure electrical parameters even within the tightest geometrical spaces. Its advanced software and hardware offer fast automated measurements, greatly easing the burden of manual operation for faster results. The unit consists of a high-resolution back-side camera, a bright image isolator, and a high-resolution thermography imaging machine. It is a non-contact wafer testing method used for the analysis of various structural defects and electrical functionalities. The tool measures using either four-corner or optical probes, providing customized measurement solutions. The mid-resolution CCD (Charge Coupled Device) camera technology accurately measures wafer surfaces and thickness without any reliability issues. The onboard software and hardware enable fast automated measurements, allowing tapeouts in production environments, shortening cycle times for analysis. This feature significantly reduces processing time when compared to manual operation. Processes such as contact bouncing, electrical leakage, hard-breakdown, stress tests, etc., are all precisely measured by T600. The asset also allows for remote operation. Through its remote user interface, customers can monitor the model's live performance and parameters from a long distance. Reports generated from the equipment can even be viewed from remote locations, allowing for detailed analysis and evaluation. Another valuable feature of NOVA T600 is its multiple mode metrology capabilities. The system can work in manual, semi-automatic, and fully automated modes, allowing it to collect multiple groups of data points with different measurement parameters. The collected data can then be used to analyze the wafer's electrical characteristics, including ohmic curves, semiconductor dielectric breakdown, leakage current, and die-to-die analysis. Overall, T600 is a powerful wafer testing and metrology unit that offers a whole range of features for fast, reliable measurements and analysis. Its advanced hardware, software, and metrology capabilities make it an ideal tool for measuring and evaluating critical wafer parameters, resulting in faster cycle times and ample data points for non-contact analysis.