Used ORC MEM-5296D #9243762 for sale

ID: 9243762
Vintage: 2006
Bump height measurement systems 2006 vintage.
ORC MEM-5296D Wafer Testing and Metrology equipment from Orion is a dual-purpose, highly-customizable, and precision wafer testing system. The unit is composed of two main testing components, an advanced optical machine and a wafer test head. The optical tool is composed of a rotating multi-axis optical structure, 4-axis manipulator with exacting motion accuracy, precision linear/rotary stages, and a 6-axis monolithic optical train. This high accuracy optical asset simplifies setup and alignment times, as well as eliminating the need for delicate operator adjustments. With an adjustable working range of up to 12.7mm, this model is well suited for production and development wafers of various sizes. The wafer test head includes built-in automatic fiducial detection for repeatable alignment of wafers. The test head is equipped with wafer alignment accuracy of up to 10nm, with high precision, power controlled probe capabilities. This automated test head has been designed to increase throughput for wafer testing with minimal operator intervention. An on-board measurement processor enables the test head to apply wafer measurements with high accuracy filtering and comparison. The equipment delivers instantly available real-time data to the operator, including parameter measurements, map plotting, average graphing, and detailed digital imaging. This website system is compatible with standard fab software frameworks including OPC, GEM, SECS-II, and HM1512A for real-time test information. It features complimentary collision detection capabilities with the click of a button, eliminating unintended crashes and providing repeatable testing results. The combination of high precision, automated wafer testing and real-time measurement processing with the combination of the advanced optics of MEM-5296D makes it an ideal solution for the wafer testing and metrology applications. Its precision, accuracy, and flexibility allow testing and metrology of a wide range of wafer sizes and testing parameters, while eliminating the need for delicate operator adjustments.
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