Used RAYTEX RXW-1226SFI #293614929 for sale

RAYTEX RXW-1226SFI is a wafer testing and metrology equipment designed to provide reliable and repeatable results for a wide range of wafer sizes, deformations, and contact types. This system is particularly suited for testing and analyzing individual dies and the entire wafer surface condition. It offers a wide range of capabilities, such as high resolution non-destructive imaging, a variety of automated test functions, and comprehensive data analysis capabilities. The unit combines a 12" wafer stage with real-time servo-controls to create a highly accurate and dynamic testing environment. The stabilization machine ensures that the wafer is aligned and held securely, allowing for precise measurements. The stage is integrated with a high-resolution imaging tool to capture up to 5500 frames of data from both each die and the entire wafer surface. This imaging asset is also capable of capturing the profile of each die using a patented edge detection algorithm. RAYTEX RXW 1226SFI includes an array of automated testing functions for a wide range of wafer deformations and contact types. An automated software suite provides functions for data analysis, statistical validation, and log file generation. This permits an immediate review and interpretation of test results. The model also supports adaptable processor cores and directly connects with external networks. The equipment is designed with safety and maintenance protocols. A fully integrated air filtration system manages the working environment while double isolation ensures a safe connection to power supplies. The built-in maintenance functions ensure that it performs at peak performance. RXW-1226SFI is a versatile and accurate wafer testing and metrology unit. It provides high-resolution imaging, automated testing functions, comprehensive data analysis, and reliable and repeatable results. With its comprehensive safety and maintenance protocols, it is an ideal solution for testing and analyzing wafers of various sizes, deformations, and contact types.