Used RUDOLPH / AUGUST 3DI 8000 #293761475 for sale

RUDOLPH / AUGUST 3DI 8000
ID: 293761475
Wafer Size: 12"
Wafer bump inspection system, 12".
RUDOLPH / AUGUST 3DI 8000 is a highly advanced wafer testing and metrology equipment. It can provide optimal accuracy and precision in the measurement of the geometrical properties of semiconductor devices on a wafer. It offers both optical microscopy and interferometric measurements of semiconductor device features. The system combines a specially designed 3 axes interferometric microscope with a precision stage to create an imaging unit for wafer measurement. The microscope consists of a base which contains two crossed-axis interferometers that allow for the measurement of two lateral and one orthogonal displacements in three dimensions. The microscope also has a collimated beam that is used to measure the vertical dimension or depth with high accuracy. In addition, the machine includes a precision stage which allows for the scanning of large wafer areas with high accuracy. AUGUST 3DI 8000 is a robust tool that is designed to be highly vibration insensitive. This asset provides an enhanced resolution of up to 1.5 nanometers and a repeatability of up to 0.2 nanometers. The model enables fast and accurate measurements of 3-dimensional information of semiconductor structures at the wafer level. RUDOLPH 3DI 8000 includes advanced image analysis software which provides the user with a comprehensive graphical display of the results. The software can also be used to analyze the data that has been captured with the equipment and to compare the acquired images with reference images. This image processing software allows for the visualization of the acquired data, and the further data analysis. 3DI 8000 offers high throughput measurements and a wide range of measurement capabilities. It is the ideal choice for professional research and development work. It is also well suited for production testing and quality control applications. This system is the perfect choice for analyzing the performance and reliability of newly developed semiconductor materials.
There are no reviews yet