Used RUDOLPH FE VII/IV #9373048 for sale

RUDOLPH FE VII/IV is a wafer testing and metrology equipment that is designed for both research and development (R&D) as well as production applications. This system offers a versatile platform for non-contact wafer inspection on both backside and frontside. The unit supports a variety of diameters and package types and has a large selection of sensors and measurement heads to detect various process non-conformities. It is capable of measuring wafer-level characteristics such as particle defect concentration, surface topography, electrical properties, chemical composition, and etch depth. The machine uses cutting-edge proprietary technology and multi-sensor imaging for fast wafer inspection and surface metrology of wafers. It has the ability to inspect up to 30 x 30 cm2/ die and is designed to support up to 8 different sections, enabling faster and more accurate data extraction. Furthermore, it provides both non-contact and contactless measurement capabilities with new microscopy image acquisition. The tool also offers a unique patented multi-axis scanning technology that comes with variable scan speed and acceleration profile. This ensures that all curvatures are eliminated and a comprehensive die-level report to evaluate wafer performance in production and design fabs. Additionally, it has data acquisition and scanning speed of up to 300 mm/second which is achieved with the help of fast CMOS line scan cameras and large field of view. Moreover, the asset offers a built-in software package with the EWI tools suite that is geared to analyze and evaluate semiconductor wafers quickly. It also provides an integrated visual analysis model for image segmentation and identification. Additionally, it has a comprehensive set of tools for automated report generation, labeling, defect classification, and statistical analysis. Finally, it also features a host of automation tools such as robotic grips, machine vision, and other robotic features. In conclusion, RUDOLPH FE VII/IV is a powerful wafer testing and metrology equipment that delivers unparalleled accuracy and speed for non-contact and contactless wafer inspection. It combines advanced proprietary technology with multi-sensor imaging to support a wide range of diamond wafer inspections from research and development to production applications. With its suite of integrated tools, it provides a fast, reliable, and comprehensive platform to evaluate and analyze semiconductor wafers.